Wistron Corporation

Zhiyi Liang

Chih-Chou Chou

Wei-Chia Huang

Yao-Chen Yang

Chih Chou Chou

Bin Luo

Chia-Jang Chen

RuiHua Wang

Liang Yang

Zhihua Liu

A casing assembly includes a casing and a light emitting module. The casing is provided with an accommodation recess formed by an inner wall surface and a light outlet portion formed by two inner peripheral edges. The accommodation recess communicates with the light outlet portion. The light emitting module is disposed in the accommodation recess of the casing and located close to the light outlet portion. The light emitting module is provided with a light emitting surface, and a normal line of the light emitting surface is non-parallel and non-perpendicular to an opening direction of the light outlet portion.

Casing assembly and monitor

A backlight includes a first casing having an opening; a second casing connected to the first casing; an optical member disposed between the first casing and the second casing, and exposed via the opening; a supporting back plate disposed between the optical member and the second casing; at least one circuit board disposed between the supporting back plate and the second casing; and a plurality of light bars disposed on the supporting back plate. The supporting back plate is disposed between the second casing and optical member. The supporting back plate includes a first area and a second area, configured such that a distance from the first area to the second casing is greater than a distance from the second area to the second casing.

Direct backlight for a display, with light bars in different planes

A light emitting diode package structure and a manufacturing method thereof and a display device are provided. The light emitting diode package structure includes a blue light emitting diode and a phosphor layer. The phosphor layer is disposed on the blue light emitting diode package structure, and the phosphor layer includes an encapsulation layer and a plurality of phosphor powders. The phosphor powders are disposed in the encapsulation layer and consist of green phosphor powders, red phosphor powders, and yellow phosphor powders, in which a weight percentage of the yellow phosphor powders ranges from 1% to 10%.

Light emitting diode package structure and manufacturing method thereof and display device

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Taipei, Taiwan

Zhiyi Liang