Huawei Digital Power Technologies Co., Ltd.

Huawei Technologies Co., Limited

Zhixiang Hu

Ken Chin

Yuanjun Liu

Wei Zhang

Zhihua Liu

Dan Yang

Shuaibing Wang

Gang Ye

Weijian Pan

A high power factor rectifier circuit includes a totem pole power factor correction (PFC) circuit, a sampling resistor, a power suppl a PFC controller, and a filter. The totem pole PFC circuit includes two bridge arm units connected in parallel between a first parallel connection point and a second parallel connection point. One end of the sampling resistor is connected to the first parallel connection point and a first reference ground, and the other end of the sampling resistor is separately connected to a sampling voltage input terminal of the PFC controller and a second reference ground. A grounding terminal of the PFC controller is connected to the first reference ground. A power output terminal of the power supply is connected to a power input terminal of the PFC controller using the filter.

High power factor rectifier circuit and power converter

The power supply conversion circuit includes an isolation transformer, and the isolation transformer includes at least two primary coils and at least one secondary coil. Each primary coil is connected to a half-bridge circuit by using a first resonant network, and half-bridge circuits corresponding to the at least two primary coils are connected in series between two electrodes of a power supply. The half-bridge circuit is connected in parallel to a voltage divider, the voltage divider includes a first capacitor and a second capacitor that are connected in series, a first terminal of the first resonant network is connected to an intermediate node of the half-bridge circuit, and a second terminal of the first resonant network is connected to a connection point between the first capacitor and the second capacitor.

Power supply conversion circuit and electronic device

A power factor correction (PFC) circuit includes an alternating current input circuit, a totem-pole PFC circuit, an input sampling circuit, an output sampling circuit, and a PFC control protection circuit. A first output terminal of the alternating current input circuit is respectively connected to a first input terminal of the totem-pole PFC circuit and a first input terminal of the input sampling circuit.

Power factor correction circuit and power converter

This application provides a resonant conversion system, including a controller and a resonant conversion circuit. The resonant conversion circuit includes a high frequency chopper circuit, a resonant cavity, a transformer, and a rectification filter network, and the high frequency chopper circuit includes switches Sand S. The controller is configured to: detect a bridge arm midpoint voltage V, and determine based on the Va current threshold signal used to indicate a current threshold; detect a resonant current on a primary side of the transformer, and compare the resonant current with the current threshold signal to control on/off of the switch Sor Sbased on the second electrical signal, so that the system operates in an inductive mode to ensure zero voltage switching of the switch, while operating in a state close to a capacitive mode to maximize the use of a gain region.

Resonant conversion system and control method

This application relates to the field of power supply packaging technologies, and in particular, to a PCB-pinout based packaged module, including a packaged module and a pin exposed outside the packaged module. The packaged module includes a PCB and a power component. The PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB. The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB. The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.

Growing community of inventors

Dongguan, China

Zhixiang Hu