Applied Materials, Inc.

Zhiqiang Guo

Phillip A Criminale

Vijay D Parkhe

Konstantin Makhratchev

Steven E Babayan

Phillip R Sommer

Dan A Marohl

Andrew Myles

Shahid Rauf

Tza-Jing Gung

Michael D Willwerth

Ankur Agarwal

Benjamin Schwarz

Masanori Ono

Chih-Hsun Hsu

Martin Perez-Guzman

Rachel Sara Stolzman

Michael Carl Hankes

Andrew S C Ho

Philip Allan Kraus

A substrate carrier is described with an array of independently controllable heater elements. In one example an apparatus includes a substrate carrier to carry a substrate for processing, a plurality of resistive heating elements in the carrier to heat the substrate by heating the carrier, a power supply to supply power to the heating elements, a power controller to provide a control signal, the control signal to control an amount of current applied to each of the heating elements, and a plurality of power interfaces in the carrier each coupled to a heating element to receive the power from the power supply and the control signal from the controller and to modulate the power applied to a respective coupled heating element in response to the control signal.

Substrate carrier with array of independently controllable heater elements

Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

Tunable temperature controlled substrate support assembly

Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heater assembly. The substrate support assembly comprises an upper surface and a lower surface; one or more main resistive heaters disposed in the substrate support; and a plurality of heaters in column with the main resistive heaters and disposed in the substrate support. A quantity of the heaters is an order of magnitude greater than a quantity of the main resistive heaters and the heaters are independently controllable relative to each other as well as the main resistive heater.

Temperature controlled substrate support assembly

A system includes an enclosure configured to couple to an equipment front end module (EFEM) of a substrate processing system, a charging assembly, and one or more support structures within the enclosure. The one or more support structures are configured to support a validation wafer in a charging position to charge the validation wafer via the charging assembly.

Substrate enclosure system with assembly for charging a validation wafer

Temperature measurement is described for a substrate carrier using a heater element array. In one example a method includes measuring a first combined current load of each of a plurality of heating elements in the electrostatic chuck, changing a power status of a first heating element of the plurality of heating elements, measuring a second combined current load of each of the plurality of heating elements after changing the power status of the first heating element, determining the difference between the first and second combined current loads, determining a temperature of the first heating element using the difference, and reverting the power status of the first heating element to that before the change and repeating changing power, measuring a current load, determining a difference, and determining a temperature for each of the other heating elements of the plurality to determine a temperature at each of the heating elements of the plurality.

Temperature measurement for substrate carrier using a heater element array

A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.

Diagnostic disc with a high vacuum and temperature tolerant power source

An enclosure system includes multiple walls forming an interior volume. The enclosure system is configured to couple to an equipment front end module (EFEM) of a substrate processing system. The enclosure system further includes a charging assembly including a first charging coil. The enclosure system further includes one or more first support structures disposed within the interior volume under the first charging coil. The one or more first support structures are configured to support a first validation wafer within a threshold distance of the first charging coil to charge the first validation wafer via the charging assembly.

Enclosure system with charging assembly

A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.

Implementations described herein provide a method for calibrating a temperature of a substrate support assembly which enables discrete tuning of the temperature profile of a substrate support assembly. In one embodiment, a system, comprises a memory, wherein the memory includes an application program configured to perform an operation on a substrate support assembly, a control board disposed in a substrate support assembly, wherein the control board comprises a processor having an wireless interface, a pulse width modification (PWM) heater controller, wherein the processor is connected with the memory to read and access the application program from the memory when in operation, and a heating element coupled to the pulse width modification (PWM) heater controller, wherein the heating element comprises a plurality of spatially tunable heaters that are individually tunable by the pulse width modification (PWM) heater controller.

Temperature tunable multi-zone electrostatic chuck

Electrostatic chucks with variable pixelated magnetic field are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A plurality of electromagnets is disposed in the base, the plurality of electromagnets configured to provide pixelated magnetic field tuning capability for the ESC.

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Sunnyvale, CA, United States of America

Zhiqiang Guo