China Wafer Level Csp Co., Ltd.

China Wafer Level Csp Ltd.

Zhiqi Wang

Wei Wang

Qiong Yu

Guoliang Xie

Guoqing Yu

Zhuowei Wang

Hanqing Hu

Ying Yang

Junjie Li

Qinqin Xu

Youjun Wang

Qiuhong Zou

Guoping Yu

Hongjun Liu

Fangyuan Hong

Quihong Zou

Zhiming Geng

Xianglong Liu

Yuanhao Xu

Yuanfei Liu

A structure and a method for packaging an image sensor chip. The structure includes: an image sensor chip and a substrate. The image sensor chip includes a first surface and a second surface that are opposite to each other, and the first surface is provided with multiple pixels configured to collect image information and multiple first bonding pads connected with the multiple pixels. The substrate covers the first surface of the image sensor chip, and is provided with wiring and a contact terminal connected with the wiring. A periphery of the image sensor chip is bonded to the substrate via an anisotropic conductive adhesive, the multiple first bonding pads are electrically connected with the contact terminal via the anisotropic conductive adhesive, and the anisotropic conductive adhesive surrounds all the multiple pixels and is not overlapped with the multiple pixels in a direction perpendicular to the substrate.

Encapsulation structure of image sensing chip, and encapsulation method therefor

An optical fingerprint recognition chip package and a packaging method are provided. In the optical fingerprint recognition chip package, a cover plate is arranged on a front surface of an optical fingerprint recognition chip, the cover plate includes a substrate and a light shielding layer. The light shielding layer is arranged on a surface of the substrate facing away from the optical fingerprint recognition chip. The substrate is provided with multiple first through holes for exposing photosensitive pixels of the optical fingerprint recognition chip. The light shielding layer is provided with multiple second through holes in one-to-one correspondence with the first through holes. During fingerprint recognition, light reflected by a finger is split through the first through holes and the second through holes, such that crosstalk among different photosensitive pixels is reduced, and the accuracy of fingerprint recognition is improved.

Optical fingerprint recognition chip package and packaging method

An image sensing chip package and an image sensing chip packaging method are provided. In the image sensing chip package, an image sensing chip is located in a through hole of a substrate, and a front surface of the image sensing chip is flush with a first surface of the substrate. In this way, in the image sensing chip package, a height of the image sensing chip is controlled with the first surface of the substrate as a reference. Since the first surface of the substrate does not change in the packaging process, almost no uncontrollable factor affects the height of the image sensing chip.

Image sensing chip package and image sensing chip packaging method

A semiconductor device and a manufacture method of the semiconductor device are provided. In the semiconductor device, a back surface of a substrate is covered with a first insulating layer, where the first insulating layer covers the bottom and the sidewall of a through hole and the back surface of the substrate outside the through hole. The first insulating layer outside the through hole is covered with a second insulating layer. When etching the first insulating layer at the bottom of the through hole, although an etching speed for a region outside the through hole is greater than an etching speed for the bottom of the through hole, the first insulating layer outside the through hole is protected from being over-etched by the second insulating layer, which improves reliability of the device.

Semiconductor device and manufacture method of the same

A chip packaging method and a chip package are provided. According to the chip packaging method and the chip package, to-be-packaged chips are located in a plastic packaging layer, and front surfaces of the to-be-packaged chips are flush with a first surface of the plastic packaging layer, and the plastic packaging material for manufacturing the plastic packaging layer has good plasticity before a curing process, so that the formed first surface and the second surface have good smoothness, thereby ensuring the reliability of the package.

Chip packaging method and chip package

A chip package and a chip packaging method are provided. The package includes: a chip to be packaged, a reinforcing layer and solder bumps. The chip to be packaged includes a first surface and a second surface opposite to each other, the first surface includes a sensing region and first contact pads, and the first contact pads are electrically coupled to the sensing region. The reinforcing layer covers the first surface of the chip to be packaged. The solder bumps are provided on the second surface of the chip to be packaged. The solder bump is electrically connected to the first contact pad and is configured to electrically connect with an external circuit.

Chip package and chip packaging method

A package for an image sensing chip is provided, which includes: an image sensing chip comprising a first surface and a second surface opposite to each other, where the first surface is provided with an image sensing region and a contact pad; a through hole extending from the second surface to the contact pad; an electrical connection layer provided along an inner wall of the through hole and extending onto the second surface; a solder mask filling the through hole and covering the electrical connection layer, wherein an opening is formed in the solder mask, and the electrical connection layer is exposed at a bottom of the opening; a guide contact pad covering an inner wall and the bottom of the opening and extending onto the solder mask; and a solder bump located on the guide contact pad.

Image sensing chip packaging structure and packaging method

A package-on-package structure of an image sensing chip is provided, which includes: an image sensing chip package, a control chip package and a circuit board. The image sensing chip package and the control chip package are arranged on the same surface of the control chip package in parallel. The image sensing chip package includes a first substrate and an image sensing chip. The control chip package includes a second substrate and a control chip. A second surface of the first substrate is electrically connected to a first region of a first surface of the second substrate, and the circuit board is electrically connected to a second region of the first surface of the second substrate. A package-on-package method for a package-on-package structure is further provided.

Package-on-package structure and package-on-package method

A method for forming an image sensor package and an image sensor package are provided. The method includes: providing a first substrate and a second substrate which includes a first surface and a second surface opposite to the first surface, and attaching either surface of the first substrate with the first surface of the second substrate with an adhesive layer; forming a groove at the second surface of the second substrate; providing a base which includes a first surface and a second surface opposite to the first surface, where the first surface of the base is provided with a sensing region and multiple contact pads; and attaching the second surface of the second substrate with the first surface of the base, where a cavity is formed between the groove and the base, and the sensing region is located within the cavity.

Packaging method and packaging structure

A fingerprint sensing chip packaging method and package are provided. The method includes: providing a cover plate, providing a fingerprint sensing chip, where a fingerprint sensing region and contact pads at periphery of the region are arranged on a front surface of the chip, electrically connecting the contact pads to a back surface of the chip, forming a first conductive structure electrically connected to the contact pads on the back surface of the chip, laminating the front surface of the chip with a back surface of the cover plate, providing a flexible printed circuit, where a second conductive structure is arranged on a back surface of the circuit and an opening is arranged in the circuit, laminating a front surface of the circuit with the back surface of the cover plate, and electrically connecting the first conductive structure to the second conductive structure.

Fingerprint sensing chip packaging method and fingerprint sensing chip package

A packaging structure and a packaging method are provided. The packaging structure includes: a chip unit, where a first surface of the chip unit includes a sensing region; and an upper cover plate structure, where a first surface of the upper cover plate structure is provided with a groove structure, the first surface of the chip unit is attached with the first surface of the upper cover plate structure, the sensing region is located within a cavity surrounded by the groove structure and the first surface of the chip unit, the upper cover plate structure further includes a second surface opposite to the first surface, and an area of the second surface of the upper cover plate structure is less than an area of the first surface of the upper cover plate structure.

Packaging structure and packaging method

A semiconductor chip package and a semiconductor chip packaging method are provided. The package includes: a semiconductor chip having a functional region, a protective substrate located on one side of the semiconductor chip and covering the functional region, and a support unit located between the protective substrate and the semiconductor chip and enclosing the functional region. The support unit includes an outer support member and an inner support member located inside the outer support member. A receiving cavity is formed between the inner support member, the semiconductor chip and the protective substrate. A hollow cavity is formed between the inner support member, the outer support member, the semiconductor chip and the protective substrate. The inner support member is provided with at least one first ventilating structure, through which the receiving cavity is in communication with the hollow cavity.

Semiconductor chip package structure and packaging method therefor

A packaging method and a package for an image sensing chip are provided. The packaging method includes: providing a wafer including a first surface and a second surface opposite to the first surface, where the wafer has multiple image sensing chips arranged in a grid, each of the image sensing chips has an image sensing region and contact pads arranged on a side of the first surface; forming an opening corresponding to each of the contact pads and cutting trenches on a side of the second surface of the wafer, where the contact pad is exposed through the opening; filling the cutting trenches with a first photosensitive ink; and applying a second photosensitive ink on the second surface of the wafer to cover the opening with the second photosensitive ink and form a hollow cavity in the opening.

Packaging method and package structure for image sensing chip

A packaging method and package structure for an image sensing chip are provided. The method includes: providing a wafer including a first surface and a second surface opposite to the first surface, where the wafer has multiple image sensing chips arranged in a grid, each having an image sensing region and contact pads arranged on a side of the first surface of the wafer; forming openings extending towards the first surface on the second surface of the wafer, to expose the contact pads; forming V-shaped cutting trenches extending towards the first surface on the second surface of the wafer; and applying a photosensitive ink on the second surface of the wafer, to completely fill the V-shaped cutting trenches, cover the openings, and form a hollow cavity between each of the openings and the photosensitive ink.

A packaging method and a packaging structure are provided. The method includes: providing a first substrate and a second substrate, the second substrate having a fist surface and a second surface opposite to each other, a side surface of the first substrate being adhered to the first surface of the second substrate via an adhesive layer; forming a groove structure on the second surface of the second substrate; providing a base, the base having a first surface and a second surface opposite to each other, the first surface of the base including a sensing region and multiple bonding pads around the sensing region; and laminating the second surface of the second substrate with the first surface of the base to form a cavity between the groove structure and the base, such that the sensing region is located in the cavity.

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Suzhou, China

Zhiqi Wang