Cisco Technology, Inc.

Apple Inc.

Zhiping Yang

Jie Xue

Anthony Fai

Evan R Boyle

Zhonghua Wu

Yida Zou

Vinayagam Arumugham

Li Li

Jovica Savic

Lekhanh Dang

Kenneth Hubbard

Hanfeng Wang

Luca Cafiero

Francisco M Matus

Kirill Kalinichev

Victor Odisho

Georgi Beloev

Greg Nayman

Songping Wu

A capacitive fingerprint sensor that may be formed of an array of sensing elements. Each capacitive sensing element of the array may register a voltage that varies with the capacitance of a capacitive coupling. A finger may capacitively couple to the individual capacitive sensing elements of the sensor, such that the sensor may sense a capacitance between each capacitive sensing element and the flesh of the fingerprint. The capacitance signal may be detected by sensing the change in voltage on the capacitive sensing element as the relative voltage between the finger and the sensing chip is changed. Alternately, the capacitance signal may be detected by sensing the change in charge received by the capacitive sensing elements as the relative voltage between the finger and the sensing chip is changed.

Capacitive sensing array having electrical isolation

Methods and apparatus for equalization of a high speed serial bus. A well-tuned passive equalization circuit for use with high frequency differential signals suffer from e.g., impedance mismatches, impedance discontinuities (e.g., connectors, etc.). In one embodiment, a shunting circuit is inserted between the differential terminals of a Universal Serial Bus (USB) cable, connector, etc. The shunting circuit is configured to 'open' at low frequencies to enable Full Speed (FS) enumeration, while also providing sufficiently high impedance at high frequencies to enable High Speed (HS) operation. In one such implementation, the shunting circuit includes a tuned resistor, capacitor, inductor, and switch element arranged in series.

Methods and apparatus for equalization of a high speed serial bus

Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit ('IC') package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Systems and methods for high-speed, low-profile memory packages and pinout designs

An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.

Semiconductor package including an embedded circuit component within a support structure of the package

A method and apparatus are provided in which a cavity is formed in a support structure, the support structure being operable to support a semiconductor device, disposing at least a portion of a circuit element in the cavity in the support structure, filling the cavity in the support structure with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material, and electrically connecting the semiconductor device to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.

Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package

A small form-factor pluggable (SFP) module includes a board with an end portion to be inserted into a connector device. A first set of signal pads is arranged along an edge of a first surface of the SFP board at the end portion and a second set of signal pads along an edge of a second surface of the SFP board at the end portion. A third set of signal pads is disposed on the second surface at the end portion, offset from the edge of the second surface. A transceiver, coupled to the signal pads of the first, second, and third sets of signal pads, is configured to transmit and receive signals via the third set of signal pads and to transmit and receive signals via at least one of the first and second sets of signal pads.

Optical module design in an SFP form factor to support increased rates of data transmission

A computerized system simulates a non-linear Decision Feedback Equalizer. The computerized system includes a user interface, an output port, and a controller coupled to the user interface and to the output port. The controller is configured to (i) receive electronic design automation commands from a user through the user interface, (ii) generate, as an electronic model of the non-linear Decision Feedback Equalizer, an electronic representation of a linear filter in response to the electronic design automation commands, and (iii) integrate the electronic representation of the linear filter into an electronic circuit design having other electronic representations of other electronic circuits. The electronic circuit design is externally accessible through the output port.

Techniques for simulating a decision feedback equalizer circuit

An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit board. The area array device also has an additional series of secondary electrical contacts coupled to the coupling surface of the device and configured to carry power signals between the area array package and the circuit board. The additional series of secondary electrical contacts provides a relatively large amount of power to the area array package while allowing a manufacturer to maintain the number of primary electrical contacts of the grid array configured to carrying data signals and therefore maintain the overall performance of the area array package.

Methods and apparatus for providing a power signal to an area array package

An improved DDR interface uses single-ended technology and phase-shifts all output data signals and the output source clock signal so that each output signal switches at a different time so that IDDQ spikes caused by I/O switching do not accumulate. A dynamic phase adjustment circuit on the receiver compensates for the phase differences. Clock jitter and skew is reduced and the number of IDDQ pins is reduced to provide a more effective design and high density package.

DDR interface for reducing SSO/SSI noise

A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit board structure and a bottom surface of the circuit board structure, vias supported by the non-conductive material, top pads electrically coupled to the vias, and bottom pads electrically coupled to the vias. The top pads are disposed along the top surface of the circuit board structure and are soldered to IC device. The bottom pads are disposed along the bottom surface of the circuit board structure and are configured to solder to the discrete components. The bottom pads include a group of angled bottom pads which is soldered to a group of the discrete components substantially at 45 degree angles relative to sides of the IC device.

Growing community of inventors

Cupertino, CA, United States of America

Zhiping Yang