Beijing Baidu Netcom Science and Technology Co., Ltd.

Beijing Baidu Netcom Science Technology Co., Ltd

Baidu USA LLC

Zhiming Luo

Binghua Zhang

Xiaozhong Li

Tianyu Zhou

Bin Yi

Yiyi Duan

Tianyi Gao

Yan Cui

Hu Tang

Xianguang Tan

A refrigeration system for a data center includes an indoor module, a main outdoor heat-dissipation module and an auxiliary outdoor heat-dissipation module, inlets of the first compressor and the second compressor are respectively connected to an outlet of the indoor module, outlets of the first compressor and the second compressor are respectively connected to a gaseous refrigerant inlet of the first condenser, liquid refrigerant outlets of the first condenser and the second condenser are respectively connected to an inlet of the indoor module, in which a refrigeration cycle passage for the data center is formed by the indoor module, the first condenser and the first compressor when the main outdoor heat-dissipation module is in a normal condition, and the refrigeration cycle passage for the data center is formed by the indoor module, the second condenser and the second compressor when the main outdoor heat-dissipation module fails.

Refrigeration system for data center

A refrigeration system is provided. The refrigeration system includes: an indoor heat exchange module configured for refrigerant to absorb heat; outdoor heat exchange modules for the refrigerant to dissipate heat. The outdoor heat exchange module includes a compression device and a condensing device; the outdoor heat exchange module is switchable between an active mode and a standby mode; in the active mode, the outdoor heat exchange module is connected to the indoor heat exchange module; in the standby mode, the outdoor heat exchange module is disconnected from the indoor heat exchange module, and the compression device of the outdoor heat exchange module is in an operation status.

Refrigerating system

A cooling system for a data center includes an evaporative condenser, a pump cabinet and a heat exchange terminal. The pump cabinet has a first branch and a second branch, the first branch including a liquid storage tank and a fluorine pump. An input end of the liquid storage tank is connected to an output end of the evaporative condenser, an output end of the liquid storage tank is connected to an input end of the fluorine pump, and an output end of the fluorine pump is connected to an input end of the heat exchange terminal. The second branch includes a compressor with an input end connected to an output end of the heat exchange terminal and an output end connected to an input end of the evaporative condenser.

Cooling system

A cooling system for a data center includes: at least one liquid-cooling heat exchanger disposed above each of the integrated circuit boards to dissipate heat from a first heat source disposed on the integrated circuit board through an internal circulation coolant in the liquid-cooling heat exchanger; a liquid-cooling distributing device comprising a first pipeline in communication with the liquid-cooling heat exchanger, a second pipeline in communication with a first cooling tower, and a heat exchanger configured to cool the internal circulation coolant from the liquid-cooling heat exchanger to a first temperature through an external circulation coolant from the first cooling tower; and the first cooling tower configured to cool the external circulation coolant supplied via the second pipeline to the second temperature, wherein the first temperature is higher than the second temperature. As a result, energy consumption can be reduced and chip-level cooling can be achieved.

Cooling system for a data center

A cooling system of a data center computer room and a data center are provided. A specific embodiment of the system comprises: a liquid cooling system, including a liquid cooling cabinet, a heat exchanger forming a first circulation loop with the liquid cooling cabinet, and a cooling tower forming a second circulation loop with the heat exchanger; and a radiant cooling system, including a water pipe absorbing radiant heat in the data center computer room, a water chilling unit forming a third circulation loop with the water pipe, and a cooling tower forming a fourth circulation loop with the water chilling unit. The embodiment has improved the cooling efficiency of the data center computer room.

Cooling system of data center computer room and data center

A method and apparatus for determining a water chilling unit for cooling a data center are provided. The method includes: acquiring a current water output parameter, a current water input parameter, a current water flow parameter and a current outdoor temperature parameter of each water chilling unit of the data center; pre-processing the water output parameter, the water input parameter, the water flow parameter and the outdoor temperature parameter to obtain a characteristic parameter of each water chilling unit; importing the characteristic parameters of each water chilling unit into a pre-established machine learning model to obtain the current electric power of each water chilling unit; and determining a water chilling unit for cooling the data center on the basis of a preset cooling load, a rated cooling capacity of the water chilling unit and the current electric power of each water chilling unit.

Method and apparatus for determining water chilling unit for cooling data center

A data center liquid cooling coolant distribution system design for multiple liquid cooled racks which are arranged in multiple rows. These rows of electronic racks are positioned spaced apart from each other to form an aisle. The data center system further includes a CDU to provide cooling liquid to the electronic racks to remove heat generated from the IT components of the electronic racks. The CDU includes a set of liquid supply and return lines coupled to room manifolds arranged within the aisle. The room manifolds are coupled to rack manifolds of each electronic rack. The rack manifolds of an electronic rack are adapted to receive a cooling liquid from the CDU via the room manifolds and to exchange the heat generated from the IT components of the electronic rack.

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Beijing, China

Zhiming Luo