University of California

North Carolina State University

Atotech Deutschland Gmbh

Lightwave Logic Inc.

Namics Corporation

Esionic Corp.

Atotech Deutschland Gmbh & Co. Kg

Zhiming Liu

David F Bocian

Jonathan S Lindsey

Werner G Kuhr

Steven Zhichao Shi

Jen-Chieh Wei

Amir A Yasseri

Michael S Lebby

Robert S Loewe

Shyam Surthi

Baoquan Chen

Qiliang Li

Qian Zhao

Veena Misra

Richard Becker

Youngwoo Yi

Lutz Brandt

Sara Hunegnaw

Lingyun Wei

Rajeeve Balkrishna Dabke

Veen Misra

Brian Shaw

Hailuo Fu

Wemer G Kuhr

Amir Yesseri

A polymer modulator including a waveguide core defined over an insulating layer and having a first passive region including a light input, a second passive region including a light output, and an active region optically coupling the passive regions into a continuous waveguide core between the input and output. The waveguide core in the first and second passive regions including one of sol-gel and SiOsurrounded by cladding including one of sol-gel and SiO. The cladding in the passive regions having a first refractive index, the waveguide core in both regions having a second refractive index at least 0.01 higher than the first refractive index. The waveguide core in the active region including sol-gel, a cladding layer of sol-gel positioned between the insulating layer and the waveguide core, the refractive index of the waveguide core is at least 0.01 higher than the refractive index of the cladding layer.

Active region-less modulator and method

An EO polymer modulator with conformal atomic layer deposition sealant layers including an active region of a device material stack with an elongated tapered active section positioned on a passive waveguide core. The device material stack supported on a substrate with the passive waveguide core defining light input and light output side surfaces. A conformal atomic layer deposition sealant layer overlying the device material stack including the light input and light output side surfaces, the conformal atomic layer deposition sealant layer defining windows for the light input and light output side surfaces.

Hybrid EO polymer modulator with ALD sealant layer

An EO polymer modulator including a substrate with a cladding layer formed on a surface and a passive waveguide core, having a cross-sectional area, formed in the cladding layer and including an elongated tapered active section. An elongated trench in the cladding layer, the elongated tapered active section of the waveguide core positioned in the elongated trench, electrodes positioned on a surface of the cladding layer on opposite sides of the elongated trench, and an elongated strip of EO polymer overlying the elongated tapered active section of the waveguide core. The elongated strip of EO polymer positioned between and parallel with the electrodes and coplanar with the electrodes.

Hybrid EO polymer modulator with silicon photonics

A method of fabricating polymer modulators includes forming an insulating layer on a platform and depositing and patterning a ground electrode on the insulating layer. A bottom polymer cladding layer, a first blocking layer, a polymer core layer, a second blocking layer, and a top polymer cladding layer are deposited in order. A third blocking layer is deposited on the top cladding layer and patterned to define vias which are used to etch ground openings through the top polymer cladding layer, the second blocking layer, the core layer, the first blocking layer, and the bottom cladding layer to the ground electrode. The openings are filled with electrically conductive material from electrical communication with the ground electrode to a surface of the top polymer cladding layer. The third blocking layer is removed and electrical contacts are formed on the top polymer cladding layer in electrical communication with the electrically conductive material.

Fabrication process of polymer based photonic apparatus and the apparatus

A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a metal oxide adhesion promoter which is activated and then metal plated. The method provides high adhesion of the non-conductive substrate to the plated metal layer.

Adhesion promoting process for metallisation of substrate surfaces

The present invention relates to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

Methods of treating metal surfaces and devices formed thereby

Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards

Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

This invention provides a new procedure for attaching molecules to semiconductor surfaces, in particular silicon. The molecules, which include, but are not limited to porphyrins and ferrocenes, have been previously shown to be attractive candidates for molecular-based information storage. The new attachment procedure is simple, can be completed in short times, requires minimal amounts of material, is compatible with diverse molecular functional groups, and in some instances affords unprecedented attachment motifs. These features greatly enhance the integration of the molecular materials into the processing steps that are needed to create hybrid molecular/semiconductor information storage devices.

High-temperature attachment of organic molecules to substrates

Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

Methods of treating a surface to promote metal plating and devices formed

This invention provides novel methods for the formation of redox-active polymers attached to surfaces. In certain embodiments, the methods involve providing redox-active molecules bearing at least a first reactive site or group and a second reactive site or group; and contacting the surface with the redox-active molecules where the contacting is under conditions that result in attachment of said redox-active molecules to said surface via the first reactive site or group and attachment of redox-active molecules via the second reactive site or group, to the redox-active molecules attached to the surface thereby forming a polymer attached to said surface where the polymers comprise at least two of said redox-active molecules.

Procedure for preparing redox-active polymers on surfaces

This invention provides a new method of forming a self-assembling monolayer (SAM) of alcohol-terminated or thiol-terminated organic molecules (e.g. ferrocenes, porphyrins, etc.) on a silicon or other group IV element surface. The assembly is based on the formation of an E-O&#x2014; or an E-S&#x2014; bond where E is the group IV element (e.g. Si, Ge, etc.). The procedure has been successfully used on both P- and n-type group IV element surfaces. The assemblies are stable under ambient conditions and can be exposed to repeated electrochemical cycling.

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Englewood, CO, United States of America

Zhiming Liu