Jiangyin Changdian Advanced Packaging Co., Ltd

Zhiming Lai

Li Zhang

Dong Chen

Jinhui Chen

Hong Xu

Qicai Chen

The present invention provides a chip packaging structure, and a packaging method thereof. The structure comprises a silicon-based main body and chip electrodes. The silicon-based main body is provided with a passivation layer on a front face thereof and passivation layer openings are provided on the passivation layer. The chip electrodes have rear faces embedded in the front face of the silicon-based main body. Front faces of the chip electrodes are exposed through the passivation layer openings. A dielectric layer is provided on an upper surface of the passivation layer, and dielectric layer openings are provided. Metal protrusion structures are provided on the front faces of the chip electrodes. An encapsulation layer is provided on side walls and a rear face of the silicon-based main body. The chip packaging structure of the present invention employs insulation protection on side walls to avoid electrical leakage and short circuit conditions.

Chip packaging structure, and packaging method thereof

Provided is a method for packaging a low-k chip, comprising: attaching onto a carrier wafer a layer of temporary strippable film; arranging inversely a chip (-) onto the carrier wafer via the temporary strippable film; attaching thin film layer I (-) onto the carrier wafer for packaging; bonding a support wafer (-) onto the thin film layer I (-) and solidifying; forming a reconstructed wafer consisting of the chip (-), thin film layer I (-), and the support wafer; detaching the reconstructed wafer from the carrier wafer; completing a rewired metal wiring (-) on thin film layer I (-); forming a metal column (-) at an end of the rewired metal wiring (-); attaching thin film layer II (-) onto a surface of the metal column (-), packaging, and solidifying; coating a metal layer (-) on the top of the metal column (-), forming BGA solder balls (-) on the metal layer (-) by means of printing or ball planting; and finally slicing into individual BGA packages the reconstructed wafer having formed the BGA solder balls (-).

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Jiangsu, China

Zhiming Lai