Freescale Semiconductor,inc.

Zhimei Sun

Zhigang Bai

Zhijie Wang

Huchang Zhang

Jiyong Niu

Mei Liu

A cleaning subsystem removes unwanted material, such as glaze, from saw blades used in a semiconductor singulation process. A cleaning module moves radially towards the saw blade and vertically with respect to the plane of the saw blade in order to enable abrasive cleaning blocks of the cleaning module to selectively remove material from either the upper and lower surfaces of the saw blade or the outer edge of the saw blade. The cleaning assembly can remove material from the saw blade at a predetermined time or position during the singulation process or upon detection of load imbalance during the rotation of the saw blade.

Growing community of inventors

Tianjin, China

Zhimei Sun