Elite Electronic Material (Zhongshan) Co., Ltd.

Elite Material Co., Ltd.

Zhilong Hu

Teng Xu

Hezong Zhang

Xiang Xiong

Shu-Hao Chang

Changyuan Li

Xiangnan Li

Cheng Li

Licheng Lin

Hongxia Peng

Yaoqiang Ming

Shuwen Liu

Chen-Yu Hsieh

Ching-Hsien Hsu

Lianhui Cai

Yuhui Liu

Xingfa Chen

Jianzhao Li

Bangjun Lan

Yalu Wang

Zongyan Zhao

A phenylvinylsilane-divinylbenzene-styrene terpolymer is prepared by copolymerizing 50 parts by weight to 70 parts by weight of phenylvinylsilane, 10 parts by weight to 20 parts by weight of divinylbenzene and 20 parts by weight to 30 parts by weight of styrene, the total amount of phenylvinylsilane, divinylbenzene and styrene being 100 parts by weight, wherein the phenylvinylsilane has a structure of Formula (I) or Formula (II). Moreover, a resin composition includes a phenylvinylsilane-divinylbenzene-styrene terpolymer and a vinyl group-containing polyphenylene ether resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board.

Copolymer, method of preparing the same, resin composition and article made therefrom

A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.

Resin composition and article made therefrom

A compound has a structure of Formula (I) below, wherein E represents a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide functional group or a diphenylphosphine oxide functional group. Moreover, a method of making the compound of Formula (I), a resin composition including the compound of Formula (I) and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including copper foil peeling strength, Z-axis ratio of thermal expansion, glass transition temperature, flame retardancy, thermal resistance after moisture absorption, dielectric constant, and dissipation factor may be improved.

Flame retardant compound, method of making the same, resin composition and article made therefrom

A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 &#x3bc;m; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, ratio of thermal expansion, copper foil peeling strength, thermal resistance after moisture absorption, dissipation factor, amount of resin cluster and appearance of cooper-free circuit board.

A phosphorus-containing silane compound has a structure of SiR(R)(R), wherein Ris a phenyl group, Ris a vinyl group, Reach independently is a structure of Formula (I) or Formula (II), and n is 1 or 2. Moreover, a method of making the phosphorus-containing silane compound, a resin composition including the phosphorus-containing silane compound and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including Z-axis ratio of thermal expansion, copper foil peeling strength, inner resin flow, branch-like pattern, dielectric constant, dissipation factor and flame retardancy may be improved. 

Phosphorus-containing silane compound, method of making the same, resin composition and article made therefrom

A resin composition includes the following components or a prepolymerized product thereof. (A) 100 parts by weight of a prepolymer and (B) 5 parts by weight to 30 parts by weight of a diallyl bisphenol resin, wherein the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction, the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. Moreover, the resin composition described above may also be made into articles such as a prepreg, a resin film, a laminate or a printed circuit board.

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.

The present disclosure pertains to the technical field of resin composite materials and more particularly relates to resin compositions and articles made therefrom, including a resin film, a prepreg, a laminate or a printed circuit board, wherein the resin composition comprises a phosphorus-containing flame retardant of Formula (I) and a prepolymerized resin prepared at least from a divinylbenzene compound, an allyl resin and an acrylate resin. The resin compositions may be further used to make a resin film, a prepreg, a laminate or a printed circuit board, which has the properties of absence of branch-like pattern on laminate surface, high glass transition temperature, low ratio of thermal expansion, and high copper foil peeling strength.

A resin composition includes a vinyl-containing polyphenylene ether resin and a multifunctional vinylsilane. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board and achieve improvement in at least one of the properties including prepreg or laminate surface appearance, glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance after moisture absorption, thermal resistance, dielectric constant, dissipation factor and inner resin flow.

Disclosed is a phosphorus-containing compound capable of serving as a flame retardant to be used in conjunction with other ingredients to make resin compositions, useful for fabricating such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including glass transition temperature, coefficient of thermal expansion, thermal resistance, flame retardancy, dielectric constant, and dissipation factor. In addition, a method of preparing the phosphorus-containing compound and a resin composition comprising the phosphorus-containing compound are also disclosed.

Flame retardant compound, method of preparing the same and use thereof

A phosphorus-containing flame retardant, a preparation method thereof, a resin composition comprising the phosphorus-containing flame retardant and an article made therefrom are disclosed. The phosphorus-containing flame retardant is characterized by having the advantages of high phosphorus content, high resin compatibility, not increasing gel time of varnish and low water absorption rate, and is therefore suitable for use as a flame retardant of various resin materials.

Phosphorus-containing flame retardant, preparation method thereof, resin composition comprising the phosphorus-containing flame retardant and article made therefrom

A compound having a structure represented by the following Formula (I), where Qand Qindividually represent a functional group containing a C&#x2550;C unsaturated bond and Jand Jindividually represent a flame retardant group containing a phosphorus atom, useful in a resin composition for fabricating articles such as a prepreg, a resin film, a laminate or a printed circuit board, such that the articles have improved one or more properties including glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance, dielectric constant, dissipation factor and flame retardancy. 

Disclosed is a resin composition, which comprises 30 parts by weight to 90 parts by weight of a maleimide resin and 15 parts by weight to 60 parts by weight of a benzoxazine resin. The resin composition may be fabricated into various articles, such as prepregs, prepregs with copper foil, resin films, resin films with copper foil, laminates or printed circuit boards, which possess at least one, more or all of the following properties: high peel strength, high thermal resistance after moisture absorption, high glass transition temperature, low thermal expansion, high thermal resistance, low dielectric constant, low dissipation factor and so on.

A resin composition comprises 100 parts by weight of epoxy resin; 2 to 50 parts by weight of carboxyl-containing butadiene acrylonitrile resin; 1 to 40 parts by weight of phosphazene; and 1 to 8 parts by weight of acrylic triblock copolymer. The resin composition may be made into various articles, such as prepregs, laminates, printed circuit boards or rigid-flex boards, and meets one, more or all of the following properties: high yield rate in solder pad fall-off test at high temperature, low dust weight loss, low stickiness, high thermal resistance, high peel strength to copper foil, and high bonding strength to polyimide layer.

Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 &#x3bc;m, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.

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Zhongshan, China

Zhilong Hu