Adeia Semiconductor Bonding Technologies Inc.

Invensas LLC

Zhijun Zhao

Roseann Alatorre

Ellis Chau

Philip Damberg

Reynaldo Co

Wei-Shun Wang

Se Young Yang

Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.

Method of forming a component having wire bonds and a stiffening layer

Microelectronic package having wire bond vias and stiffening layer

Method of making wire bond vias and microelectronic package having wire bond vias

A microelectronic package can include wire bonds having bases bonded to respective conductive elements on a substrate and ends opposite the bases. A dielectric encapsulation layer extending from the substrate covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds which are uncovered by the encapsulation layer. Unencapsulated portions can be disposed at positions in a pattern having a minimum pitch which is greater than a first minimum pitch between bases of adjacent wire bonds.

Package-on-package assembly with wire bond vias

Growing community of inventors

San Jose, CA, United States of America

Zhijun Zhao