Boe Technology Group Co., Ltd.

Boe Mled Technology Co., Ltd.

Zhijun Xiong

Haiwei Sun

Junjie Ma

Yuanda Lu

Shanwei Yang

Linxia Qi

Jiawei Zhao

Lingyun Shi

Jinpeng Li

A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Light-emitting diode chip, display substrate and manufacturing method thereof

A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Light-emitting chip and light-emitting substrate

Growing community of inventors

Beijing, China

Zhijun Xiong