Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Zhijun Lv

Feng Zhang

Wenqu Liu

Liwen Dong

Zhao Cui

Xiaoxin Song

Detian Meng

Qi Yao

Libo Wang

Dongfei Hou

Ning Dang

Shizheng Zhang

Guangcai Yuan

Zhanfeng Cao

Ke Fei Wang

Zhiwei Liang

Fangzhen Zhang

Yingwei Liu

Haixu Li

Xue Dong

Huijuan Wang

Hsuanwei Mai

Chuanxiang Xu

Tao Gao

Haitao Huang

Yang Yue

Jing Niu

Shuang Sun

Wenqian Luo

Liuqing Li

Bin Zhang

Shi Shu

Ce Ning

Bing Jiang Sun

Xinhong Lu

Yong Ma

Muxin Di

Guoqiang Wang

Jiushi Wang

Zhiyong Liu

Yue Shi

Mengya Song

Yuqiao Li

Changzheng Wang

Minghua Xuan

Zhen Liu

Jifeng Tan

Feng Qu

Han Yue

Xiandong Meng

Fei Wang

Weifeng Zhou

Seungjin Choi

Xiufeng Li

Jing Feng

Wusheng Li

Ke Wang

Tingting Zhou

Jingxia Gu

Tailiang Li

Seung Jin Choi

Lizhen Zhang

Zhonglan Zhao

Jalil Ryu

Kexin Lu

Mingqi Chen

A phase shifter, a manufacturing method thereof and an electronic device are provided. The phase shifter includes opposite first and second substrates, and a tunable dielectric layer and first isolation components therebetween. The first substrate includes a first dielectric substrate and a first electrode on a side of the first dielectric substrate close to the tunable dielectric layer; the second substrate includes a second dielectric substrate and a second electrode on a side of the second dielectric substrate close to the tunable dielectric layer; the phase shifter includes a phase shift region and a peripheral region; the phase shift region includes overlapping regions; the first electrode and the second electrode are both in the phase shift region, and orthographic projections of the first electrode and the second electrode on the first dielectric substrate at least partly overlap with each other in the overlapping regions, to form overlapping capacitors.

Phase shifter having first and second substrates with a tunable dielectric layer and isolation components disposed therebetween

A sound generating panel, a display device with a screen generating sound and a method for manufacturing a sound generating panel are provided. The sound generating panel includes sound generating unit groups, each of which includes sound generating units. Each sound generating unit includes a support layer with openings and two piezoelectric structures resonating through a cavity, improving a sound pressure generated by the sound generating panel. Each sound generating unit group includes sound generating units with different radii, thereby realizing sound generating at different frequencies, and improving a sound effect of the sound generating panel. Each of some sound generating unit groups includes ultrasonic detection units for detecting a distance between a listener and the sound generating panel, so that an effect of automatically regulating and controlling a volume of sound is realized. In the display device, the sound generating panel is on a display side of a display panel, so that sound waves can directly enter human ears. The sound generating panel provided by the present disclosure is capable of automatically regulating and controlling the volume of sound and having a vivid sound effect, and the sound generating panel is integrated to the display panel, improving a level of integration of a screen.

Sound generating panel and method for manufacturing the same, display device with screen generating sound

A driving backplane, a transfer method for a light-emitting diode chip (), and a display apparatus. The driving backplane comprises: a base substrate (), a driving circuit, a plurality of electromagnetic structures (), and a plurality of contact electrodes (). The plurality of electromagnetic structures () in the driving backplane are symmetrically arranged relative to a first straight line (L) and a second straight line (L). A current signal can be applied to each electromagnetic structure () by means of the driving circuit. Stress generated by a transfer carrier plate () according to the magnetic force of each electromagnetic structure () moves the transfer carrier plate (). When the transfer carrier plate () is stress balanced in each direction parallel to the surface of the transfer carrier plate (), the light-emitting diode chip () is precisely aligned to corresponding contact electrodes ().

Driving backplane, transfer method for light-emitting diode chip, display apparatus

A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

Display backboard and manufacturing method thereof and display device

Provided is a display substrate, which includes a base substrate, a circuit structure layer disposed on the base substrate, multiple ultrasonic sensing elements and multiple micro light-emitting elements. The multiple ultrasonic sensing elements are disposed on a side of the circuit structure layer away from the base substrate, and are electrically connected to the circuit structure layer, and the multiple light-emitting elements are disposed on the side of the circuit structure layer away from the base substrate, and are electrically connected to the circuit structure layer. An orthographic projection of the multiple ultrasonic sensing elements on the base substrate does not overlap with an orthographic projection of the multiple micro light-emitting elements on the base substrate.

Display substrate and preparation method thereof, and display apparatus

Provided are a phase shifter, a method for manufacturing the same, and an electronic device. The phase shifter includes: a first substrate and a second substrate that are oppositely arranged, and heat conduction structures arranged between the first substrate and the second substrate. Orthographic projections of the heat conduction structures and orthographic projections of phase shifting units on the same substrate do not overlap each other.

Phase shifter, method for manufacturing same, and electronic device

The present disclosure provides a supporting substrate, including: a base substrate and a plurality of connecting electrodes provided on the base substrate, wherein a clamping electrode is provided on a side of at least one of the connecting electrodes facing away the base substrate, the clamping electrode is electrically connected with a corresponding connecting electrode and configured to be capable of clamping and fixing an electrode pin of the micro-light emitting device. The present disclosure also provides a manufacturing method for the supporting substrate, and a backplane.

Supporting backplane, manufacturing method therefor and backplane

The present application discloses a display panel and a preparation method thereof. The display panel includes a base substrate provided with a circuit area and a light-emitting area; a driving circuit located in the circuit area of the base substrate; an organic insulating layer covering the light-emitting area of the base substrate; a light-emitting element embedded in the organic insulating layer, where an overlap area between the orthographic projection of the light-emitting element on the base substrate and the orthographic projection of the driving circuit on the base substrate is 0; and a first lapping electrode located on the side, facing away from the base substrate, of the light-emitting element, where the light-emitting element is electrically connected to the driving circuit through the first lapping electrode.

Display panel and preparation method thereof

The disclosure provides a displaying substrate, a manufacturing method thereof, and a display panel, and relates to the technical field of display. The displaying substrate comprises a first supporting base (), plurality of vibrating element modules (), and a display module (). The display module () comprises display units (), connecting units () and hollowed-out units (). Each connecting unit () is located between two adjacent display units (). Each hollowed-out unit () is located between two adjacent display units () except an area where the corresponding connecting unit () is located. The hollowed-out units () are provided with cavities () corresponding to the vibrating element modules (). Orthographic projections of the hollowed-out units () on a reference plane cover orthographic projections of the vibrating element modules () on the reference plane. The vibrating element modules () and the cavities () form a transducer.

Displaying substrate, manufacturing method thereof, and display panel

The present disclosure relates to a backlight module, a method for designing the same, and a display device. The backlight module includes: a first substrate; a plurality of LED chips on the first substrate; and a light control structure on the first substrate. The backlight module includes a plurality of light control region groups in one-to-one correspondence with the plurality of light-emitting diode chips, each light control region group includes at least a first light control region and a second light control region. The light control structure includes a plurality of light control substructure groups respectively located in the plurality of light control region groups. Each light control substructure group includes at least a first light control substructure in the first light control region and a second light control substructure in the second light control region.

Backlight module, method for designing the same, and display device

This disclosure relates to a see-through display device, including: a collimated light source assembly, configured to form collimated light and control a light emitting direction; a first light extraction layer, configured to extract, in a collimated manner, the light ray transmitted inside the light guide plate through a light extraction outlet; an extinction layer and a second light extraction layer, wherein the extinction layer includes a light guide region and a light absorption region which are arranged alternately, and the second light extraction layer includes multiple light extraction inlets; a reflecting layer, arranged on a side, close to the light guide plate, of the second light extraction layer and configured to reflect the collimated light extracted from the light extraction outlet to the light guide plate; and a liquid crystal dimming layer. This disclosure further relates to a manufacturing method of the see-through display device.

See-through display device and manufacturing method thereof

Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Display backplate and method for manufacturing same, display panel and method for manufacturing same, and display device

Provided are a display panel and a preparation method thereof, and a display apparatus. The display panel includes a first display region, and the first display region includes multiple sub-display regions and a first light transmittance region located between adjacent sub-display regions. Each first sub-display region of the multiple sub-display regions includes a first light-emitting element and a first filter unit disposed in a first light-emergence direction of the first light-emitting element. Each second sub-display region in the multiple sub-display regions includes a first collimating light extraction element disposed in a second light-emergence direction of the first light-emitting element and a second filter unit disposed in a light-emergence direction of the first collimating light extraction element.

Display panel and preparation method thereof, and display apparatus

The present disclosure relates to a display substrate and a method for manufacturing the same. The display substrate includes: a substrate; a first electrode located on the substrate; and a conductive convex located on the first electrode. A dimension of a cross section of the conductive convex along a plane parallel to the substrate is negatively correlated to a distance from the cross section to a surface of the first electrode.

Display substrate and method for manufacturing the same

Disclosed are a transfer carrier and a manufacturing method thereof, and a method for transferring a light-emitting diode chip. The transfer carrier includes: a substrate having a plurality of via holes penetrating a thickness of the substrate, the substrate having a first surface and second surface which are opposite to each other; and thermoplastic structures filling corresponding ones of the via holes, one end of the thermoplastic structures protruding from the second surface of the substrate, and the other end covering a surrounding area on the first surface, of the corresponding via holes.

Transfer carrier and manufacturing method thereof, and method for transferring light-emitting diode chip

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Beijing, China

Zhijun Lv