Boe Technology Group Co., Ltd.

Hefei Boe Optoelectronics Technology Co., Ltd.

Syniverse Communications, Inc.

Zhihai Zhang

Xianxue Duan

Kui Gong

Tianzhen Liu

Yajun Li

Haifeng Cui

Jun Zhang

Huiyue Xu

Xuecheng Hou

David Zhang

Wei Tian

Zhaofan Liu

Xiaohua Yuan

Ying Qian

Xianxi Cui

Biliang Dong

Yang-Sik Youn

The present application provides a fabricating method of a displaying base plate, a displaying base plate and a displaying device, wherein the displaying base plate includes a tapping region, an edge region surrounding the tapping region and a displaying region surrounding the edge region, and the displaying base plate within the edge region includes: a substrate base plate, and a planarization layer provided on one side of the substrate base plate; and a spacer wall and an organic functional layer that are provided on one side of the planarization layer that is further away from the substrate base plate, wherein the organic functional layer is partitioned on sides of the spacer wall; wherein a material of the spacer wall includes a photoinduced deformed material that has had an expansive deformation and a cross-linking reaction.

Fabricating method of displaying base plate, displaying base plate and displaying device

The present disclosure relates to the field of display technology, and discloses a display substrate, a preparation method thereof, and a display panel, used for improving the structure of the display substrate, improving characteristics of a thin film transistor, and increasing the yield of a display product. The display substrate includes: a base substrate; a thin film transistor on the base substrate; and a flattening layer on a side, away from the base substrate, of the thin film transistor, wherein the flattening layer is provided with a groove around a channel area of the thin film transistor, and an orthographic projection of the groove on the base substrate is not overlapped with an orthographic projection of the channel area on the base substrate.

Display substrate, preparation method thereof, and display panel

The present invention provides an optical detection module, a method for manufacturing the same and an optical detection substrate. The optical detection module includes: a base substrate; a switch transistor on a side of the base substrate and including a gate electrode, an active layer, a first electrode and a second electrode; a photosensitive device for sensing light, on a side of the switch transistor away from the base substrate and including a power electrode, a photosensitive layer and an output electrode stacked in sequence, the output electrode being electrically connected to the first electrode of the switch transistor; a barrier on a side of the switch transistor away from the base substrate; and an insulation portion on the same layer as the output electrode and the barrier and connected between the output electrode and the barrier.

Optical detection module, method for manufacturing optical detection module, and optical detection substrate

A display substrate including: a base substrate, wherein at least one bonding element to be electrically connected to an external component is disposed in a peripheral region of the base substrate. The bonding element includes a first conductive layer, a second conductive layer and an insulation layer. The first conductive layer includes a metal oxide conductive lead. The second conductive layer includes a metal conductive lead. One or more via holes are provided in a region of the insulation layer. The metal conductive lead is electrically connected to the metal oxide conductive lead through the one or more via holes. The bonding element further comprises a via hole protection layer. A reflective liquid crystal display panel and an electrical apparatus are provided.

Display panel and electronic apparatus

An array substrate and a manufacturing method thereof are disclosed. The method includes: forming a first thin film transistor which includes a first semiconductor layer, a first gate electrode, a first drain electrode and a first source electrode; forming a second thin film transistor which includes a second semiconductor layer, a second gate electrode, a second drain electrode and a second source electrode; and forming a dielectric layer which spaces the first semiconductor layer apart from the second semiconductor layer; the method further includes: processing the same layer to form at least one selected from the group consisting of the first gate electrode, the first drain electrode and the first source electrode, at least one selected from the group consisting of the second gate electrode, the second drain electrode and the second source electrode, and the dielectric layer by the same layer.

Array substrate and manufacturing method thereof

A manufacturing method of a flexible display device and a flexible display device are provided. The manufacturing method of the flexible display device includes: forming a conductive heating layer with a first microstructure pattern on a hard substrate; forming a flexible substrate layer on the conductive heating layer, and forming a display device on the flexible substrate layer; performing a heating treatment on the conductive heating layer to separate the flexible substrate layer from the conductive heating layer, and a side of the flexible substrate layer away from the display device having a second microstructure pattern after being separated.

Manufacturing method of flexible display device and flexible display device

An organic electroluminescent display panel is provided, including a pixel defining layer. The pixel defining layer includes a plurality of openings and a bank surrounding each of the plurality of openings and defining a plurality of pixel areas. The bank is composed of a hydrophilic material pattern layer and a conductive hydrophobic pattern layer which are stacked from bottom to top.

Organic electroluminescent display panel, manufacturing method thereof, and display device

A package structure, a packaging method and an organic light-emitting diode (OLED) device are provided. The package structure includes a first substrate and a second substrate which are arranged opposite to each other, and a sealant portion which is disposed between the first substrate and the second substrate, a first enclosed cavity being encircled by the first substrate, the second substrate and the sealant portion; a structure to be packaged being disposed in the first enclosed cavity; and a second enclosed cavity being disposed in the sealant portion and filled with hydrophobic liquid.

Encapsulation structure and encapsulation method, and OLED apparatus

This disclosure relates to an OLED display apparatus and the preparation method thereof. The OLED display apparatus comprises, from the bottom to the top, a substrate, an OLED device, a thin film inner layer, an ethylcellulose layer, and a thin film outer layer. By adding a hydrophobic ethylcellulose layer with a photosensitive material and a singlet oxygen receptor dissolved therein on the basis of current thin film packaging, this invention can have the functions of water vapor barrier and oxygen absorption so as to improve the service life of devices.

OLED display apparatus and preparation method thereof

An interworking solution only requires that Greenfield LTE deploy the IWF and IMS AS, and set up the connections between their MME and IWF for the IMSI attach procedure. The solution uses an IMS client that can be installed on the roamer's devices. Thus once the roamer is attached to the LTE network together with IMSI attach via IWF function, and registered into the IMS system, the roamer can receive voice call and SMS by the original phone number, even though the LTE operator network does not support CSFB.

Growing community of inventors

Beijing, China

Zhihai Zhang