Dow Global Technolgoies LLC

Rohm & Haas Electronic Materials LLC

Rohm and Haas Company

Dow Silicones Corporation

Rohm and Haas Electronic Materials Korea Ltd.

Ddp Specialty Electronic Materials Us, LLC

Zhifeng Bai

Michael K Gallagher

Christopher John Tucker

Mark S Oliver

Liang Chen

Yiyong He

Jodi M Mecca

Sudhakar Balijepalli

Jake Joo

Zidong Wang

Elissei Iagodkine

Jessica Ye Huang

James C Taylor

Karen R Brantl

Matthew T Bishop

Yuming Lai

Valeriy V Ginzburg

Ing-Feng Hu

Michael P Tate

Tirtha Chatterjee

Leslie E O'Leary

Elissei Lagodkine

Michael Brasseur

In-Kyung Sung

A polymer composite comprising quantum dots; said polymer composite comprising: (a) quantum dots; (b) polymerized units of a first compound having at least one readily polymerizable vinyl group, a molecular weight from 300 to 20,000 and at least one continuous acyclic hydrocarbyl chain of at least five carbon atoms; and (c) polymerized units of a second compound having at least one readily polymerizable vinyl group and a molecular weight from 100 to 750; wherein a readily polymerizable vinyl group is part of a (meth)acrylate ester group or is attached directly to an aromatic ring, and the molecular weight of the first compound minus the molecular weight of the second compound is at least 100.

Polymer composite containing quantum dots

A polymer composite comprising quantum dots. The polymer composite comprises: (a) quantum dots; (b) a first polymer having a molecular weight from 1,000 to 100,000 and a solubility parameter from 12 to 17 (J/cm); (c) a second polymer comprising polymerized units of a first compound comprising at least one readily polymerizable vinyl group and having a molecular weight from 72 to 500, wherein the second polymer has a solubility parameter from 16.5 to 20 (J/cm); and (d) a third polymer comprising polymerized units of a second compound comprising at least two readily polymerizable vinyl groups and having a molecular weight from 72 to 2000; wherein the first polymer encapsulates the quantum dots; wherein a readily polymerizable vinyl group is part of a (meth)acrylate ester group or is attached directly to an aromatic ring.

Curable resin system containing quantum dots

A polymer resin comprising: (a) quantum dots, (b) a compound of formula (I) (I) wherein Ris hydrogen or methyl and Ris a C-Caliphatic polycyclic substituent, and (c) a block or graft copolymer having Mn from 50,000 to 400,000 and comprising from 10 to 100 wt % polymerized units of styrene and from 0 to 90 wt % of a non-styrene block; wherein the non-styrene block has a van Krevelen solubility parameter from 15.0 to 17.5 (J/cm). 

Rheology modifiers for encapsulating quantum dots

The present invention provides methods for making polymerizable monomer compositions comprising purifying a (b) monomer mixture of (i) one or more monomers having at least two polymerizable vinyl groups and (ii) one or more monomers having a single polymerizable vinyl group as part of a (meth)acrylate ester group by any one or more of treating the monomer mixture in an activated porous alumina or silica column, sieve drying the monomer mixture in a vacuum followed by drying over dried molecular sieves having average pore sizes of from 2 to 20 Angstroms, freeze-pump-thaw (FPT) treating by freezing the monomer mixture in a vessel or container to a temperature below &#x2212;75&#xb0; C., degassing the monomer mixture by application of vacuum in the range of 10to 10Pa, sealing the vessel or container under vacuum, and thawing the composition to room temperature; and, combining in an inert gas atmosphere the resulting monomer mixture (b) with a composition (a) of quantum dots in dry form or organic solvent solution.

Methods for making improved quantum dot resin formulations

Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Ephemeral bonding

Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.

Method of releasably attaching a semiconductor substrate to a carrier

Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Toughened arylcyclobutene polymers

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Midland, MI, United States of America

Zhifeng Bai