Chengdu Boe Optoelectronics Technology Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Zhibing Lin

Jia Deng

Jialin Wang

Chaoxue Qin

Haitao Liang

Fei Zeng

Guodong Zhou

A bonding device includes: a supporting assembly, comprising a first and second supporting bodies arranged in a first direction, at least one of the first and second supporting bodies is movable in the first direction, the supporting assembly having an upper surface which faces a flexible substrate and matches an inner surface of the flexible substrate; and a stretching assembly, including a carrier film and a plurality of driving elements, a central area of the carrier film being attached to the inner surface of the flexible substrate, at least two of the plurality of driving elements arranged oppositely in the first direction, at least two of the plurality of driving elements arranged oppositely in a second direction, the plurality of driving elements are connected to peripheral portions of the carrier film, and stretches the peripheral portions of the carrier film to align the inner surface with the supporting assembly.

Bonding device and bonding method

Growing community of inventors

Beijing, China

Zhibing Lin