Guangzhou Fang Bang Electronics Co., Ltd.

Guangzhou Fang Bang Electronic Co., Ltd.

Zhi Su

Qiang Gao

A metal foil that has a carrier and a preparation method thereof. The metal foil with a carrier comprises a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping lay, and the metal foil layer are sequentially stacked, or the carrier layer, the striping layer, the barrier layer, and the metal foil layer are sequentially stacked. The diffusion depth of the carrier layer to the metal foil layer is less than or equal to 3 μm and the diffusion depth of the metal foil layer toward the carrier layer is less than or equal to 3 μm at a temperature of 20-400° C. By setting the barrier layer, the carrier layer and the metal foil layer are prevented from diffusing mutually to cause bonding at a high temperature, so that the carrier layer and the metal foil layer are easy to peel off.

Metal foil with carrier and preparation method thereof

Provided are a scattering film and an electronic device with the scattering film. The scattering film includes: a carrier layer configured to emit microwave signals and/or receive microwave signals and a first protruding structure arranged on the surface of the carrier layer; and when passing through the first protruding structure, microwaves are reflected. According to the solution, a first protruding structure is provided, and microwaves can be reflected when passing through the first protruding structure, so that the transmitting and/or receiving space range for the microwaves which are originally only directionally transmitted is enlarged, and the coverage range of microwave signals is increased.

Scattering film and electronic device with scattering film

A shielding film and a circuit board are provided. The shielding film includes a first film layer (), a contrast structural layer () and an electromagnetic shielding layer (). The first film layer () is disposed on a first side of the electromagnetic shielding layer (). The contrast structural layer () is disposed on the first side of the electromagnetic shielding layer (). The grayscale value of the color of the contrast structural layer () is greater than the grayscale value of the color of the first film layer (). In the contrast structural layer () and the first film layer (), a hollowed-out pattern of an identification code is formed on a layer away from the electromagnetic shielding layer ().

Shielding film and circuit board

The present disclosure provides a circuit board for high frequency transmission and a shielding method. The circuit board for high frequency transmission includes: a first shielding film, a second shielding film and a circuit board body. The circuit board body includes a first surface and a second surface that are arranged opposite to each other. The first shielding film covers the first surface, and the second shielding film covers the second surface. The circuit board body is provided with a wire region. The first shielding film and the second shielding film are in electrical connection at a lateral side of the wire region. Therefore, leaky waves at the lateral side of the circuit board body are effectively avoided, and the circuit board body is thin in structure.

Circuit board for high frequency transmission and shielding method

A circuit board and an electronic device are provided. The circuit board includes a circuit board body () and a shielding film layer (), and further includes a dielectric layer (), where the dielectric layer () is arranged between the circuit board body () and the shielding film layer ().

Circuit board and electronic device

A connector and a manufacturing method of the connector are provided. The connector, comprising an insulator (), a first conductive layer () disposed on one side surface of the insulator (), and a second conductive layer () disposed on the other side surface of the insulator (), the insulator () is further provided with a conductive medium () connecting the first conductive layer () and the second conductive layer (), and a protrusion portion () is disposed on the surface of the first conductive layer () or/and the second conductive layer ().

Connector and manufacturing method

A flexible connector, comprising an insulator (), multiple first conductors () are disposed on one side surface of the insulator (), and multiple second conductors () are disposed on the other side surface of the insulator (), the insulator () is further provided with a conductive medium () connecting the first conductors () and the second conductors (), and protrusion portions () are disposed on the surfaces of the first conductors () and the second conductors ().

Flexible connector and manufacturing method

An electromagnetic scattering film, and an electronic device with the electromagnetic scattering film are provided. The electromagnetic scattering film includes a metal layer, wherein the metal layer is provided with a through hole penetrating through an upper surface and a lower surface of the metal layer, and a maximum value of the distance s between any two points on a contour of a section of the through hole is less than the wavelength &#x3bb; of a microwave emitted into the through hole, such that the microwave is diffracted after being emitted into the through hole. By arranging, on the metal layer, a through hole being smaller than the wavelength of a microwave, the microwave, which was originally transmitted in a linear manner, is diffracted after being emitted into the through hole, thereby expanding a microwave transmission and/or receiving space range.

Electromagnetic scattering film and electronic device with electromagnetic scattering film

A composite metal foil and a preparation method thereof are provided. The composite metal foil includes a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping layer, and the metal foil layer are sequentially stacked, the barrier layer includes a metal bonding layer and a high-temperature resistant layer stacked, and the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer. The striping layer is disposed between the carrier layer and the metal foil layer so as to facilitate peeling of the carrier layer, and the barrier layer is disposed between the carrier layer and the metal foil layer so as to prevent the carrier layer and the metal foil layer from diffusing mutually to cause bonding at a high temperature, so that the carrier layer and the metal foil layer are easy to peel off. In addition, the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer, so that the barrier layer is not easy to separate from the carrier layer, and peeling between the barrier layer and the carrier layer is prevented.

Composite metal foil and preparation method thereof

Provided are an Electromagnetic Interference (EMI) shielding film, a circuit board including the EMI shielding film, and a preparation method for the EMI shielding film. The EMI shielding film includes a shielding layer and an adhesive film layer, wherein the shielding layer includes a first surface and a second surface opposite to each other; the second surface is a rolling uneven surface; convex conductor particles are also formed on the rolling uneven surface; and the second surface of the shielding layer is provided with the adhesive film layer, so the adhesive film layer of the EMI shielding film will extrude adhesive materials into recesses of the second surface in a lamination process, the adhesive holding capacity is increased, and delamination and blister of board is unlikely to occur. Moreover, the rolling uneven surface also has conductor particles with a certain height, so it can be ensured that the shielding layer smoothly punctures the adhesive film layer in the lamination process, reliable grounding is achieved, and the practicality is strong.

Electromagnetic interference (EMI) shielding film, circuit board, and preparation method for EMI shielding film

Disclosed are an electromagnetic interference shielding film, a circuit board and a preparation method for the electromagnetic Interference shielding film. The electromagnetic interference shielding film includes a first shielding layer, a second shielding layer, an adhesive film layer and multiple convex particles, wherein a second surface of the first shielding layer is an undulating uneven surface; the multiple convex particles are adhered on the second surface of the first shielding layer; the second shielding layer is disposed on the second surface of the first shielding layer and covers the multiple convex particles, thereby forming a protrusion portion on an outer surface of the second shielding layer and forming a recessed portion at other positions; the undulation degree of the outer surface of the second shielding layer is greater than that of the second surface; and the adhesive film layer is disposed on the outer surface of the second shielding layer.

Electromagnetic interference shielding film, circuit board, and preparation method for electromagnetic interference shielding film

Disclosed are an Electromagnetic Interference shielding film, a circuit board and a preparation method of the electromagnetic Interference shielding film. The electromagnetic Interference shielding film includes: a first shielding layer, a second shielding layer, an adhesive film and multiple convex particles, wherein the first shielding layer includes a first surface and a second surface opposite to each other; the second surface is a flat surface; the multiple convex particles are adhered on the second surface of the first shielding layer; the second shielding layer is disposed on the second surface of the first shielding layer and covers the multiple convex particles, thereby forming a protrusion portion at a position corresponding to the convex particles on an outer surface of the second shielding layer and forming a gentle portion at other positions; and the adhesive film is disposed on the outer surface of the second shielding layer.

A free grounding film and a manufacturing method therefor, and a shielding circuit board including the free grounding film and a grounding method. The free grounding film includes at least one conductor layer. The shielding circuit board including the free grounding film is formed in a manner that an electromagnetic wave shielding film is arranged on a printed circuit board, and the upper surface of the electromagnetic wave shielding film is provided with the free grounding film. The grounding method for the shielding circuit board adopts one of three modes.

Free grounding film and manufacturing method therefor, and shielding circuit board including free grounding film and grounding method

The present invention discloses an electromagnetic wave shielding film, comprising at least one electromagnetic shielding layer. A printed circuit board comprising the shielding film, is formed by tightly connecting the electromagnetic wave shielding film with the printed circuit board in the direction of thickness, wherein a ground layer is disposed on said printed circuit board. A method for producing the circuit board, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the adhesive film layer by a rough surface of the electromagnetic shielding layer, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the shielding film by an electrically conductive substance, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) forming through holes or blind holes in the circuit board; (3) metallizing the holes, to achieve grounding. The adhesive film layer of the shielding film of the present invention contains no conductive particle, so that the cost and the insertion loss are reduced, and the development demand of high-speed and high-frequency of the electronic products is met.

Electromagnetic wave shielding film and method for producing a circuit board comprising the shielding film

The present application provides an ultrathin shielding film of high shielding effectiveness, comprising two or more solid shielding layers. An electrically-conductive adhesive layer is coated onto the outer surface at one side of the solid shielding layers, and one or more insulation film layers are formed on the outer surface at the other side of the solid shielding layers. A carrier film layer is provided on the outer surface of the insulation film layers. A protective film covers the lower surface of the electrically-conductive adhesive layer. The present application further discloses a manufacturing method of an ultrathin shielding film of high shielding effectiveness. The present application has the following advantages: the two or more ultrathin complete solid shielding layers are provided, which are capable of repeatedly reflecting and adsorbing high-frequency interference signals, and meanwhile, excessive charges are conducted into a ground layer, so that the high shielding effectiveness is realized; tests show that, at a frequency over 300 MHz, the shielding effectiveness can reach 60 dB or more; meanwhile, the ultrathin solid shielding layer is capable of providing great bending performance, so that the requirements of an electronic product for lightness and thinness are met.

Growing community of inventors

Guangzhou, China

Zhi Su