Lenovo (singapore) Pte. Ltd.

National University of Singapore

International Business Machines Corporation

Agency for Science, Technology and Research

Zhi Ning Chen

Duixian Liu

Brian Paul Gaucher

Thomas Richard Hildner

Michael Yan Wah Chia

Ullrich Richard Pfeiffer

Thomas M Zwick

Apparatus and methods are provided for integrally packaging antenna devices with semiconductor IC (integrated circuit) chips, wherein IC chips are packaged with dielectric resonators antennas that are integrally constructed as part of a package molding (encapsulation) process, for example, to form compact integrated radio/wireless communications systems for millimeter wave applications.

Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips

Low-profile, compact embedded antenna designs are provided for use with computing devices, such as laptop computers, which enable ease of integration within computing devices with limited space, while providing suitable antenna characteristics (e.g., impedance matching and radiation efficiency) over a desired bandwidth of operation. Compact antenna designs with reduced antenna size (e.g., antenna height) and increased operational bandwidth (e.g., broadband impedance matching) are achieved using slotted ground plane designs and/or doubling antenna feeding schemes.

Low-profile embedded antenna architectures for wireless devices

A compact sized embedded, multiband, multi-standard, interoperable antenna for portable devices used in wireless applications is provided. The antenna design includes an asymmetrical structure provided on a double-sided printed circuit board. The asymmetrical structure covers both the ultra-wideband and the wireless local area network band. The asymmetrical structure provided on the front side of the printed circuit board is a primary radiator with a supplement strip radiator, whereby the bottom of the primary radiator is close to the vertical ground plane and fed by a probe extended from a coaxial line. The asymmetrical structure on the front side provides a well-matched bandwidth covering the ultra-wideband band of 3.1 GHz to 10.6 GHz. A second supplement strip is provided on the backside of the printed circuit board which provides the second resonance at the 2.4 GHz wireless local area network band.

Embedded multiband antennas

Low-profile, compact UWB embedded antenna designs are provided for use with computing devices, such as laptop computers, which enable ease of integration within computing devices with limited space, while providing suitable antenna characteristics (e.g., impedance matching and radiation efficiency) over an operating bandwidth of about 1 GHz to about 11 GHz.

Low-profile embedded ultra-wideband antenna architectures for wireless devices

A suspended plate antenna for broadband applications is disclosed. The antenna comprises a plate radiator, a slot cut in the plate radiator, and a substantially balanced feeding structure symmetrically feeding the plate radiator with respect to at least one midline of the plate radiator.

Low cross-polarization broadband suspended plate antennas

Feeding structures for suspended plate antennas are disclosed hereinafter for enhancing the impedance bandwidth performance thereof. In any of these feeding structures, a multi-dimensional broadband impedance transformer is integrated with a suspended plate antenna. The impedance transformer electrically connects the radiating plate and feeding probe of the suspended plate antenna. As a result, the impedance bandwidth is increased. Moreover, the multi-dimensional design of the impedance transformer is variable to allow the flexible design and adjustment of the feeding structure.

Broadband suspended plate antenna with multi-point feed

A broadband plate antenna (,) is disclosed, which includes a ground conductor (,) and a radiating element (,) which is separated from the ground conductor (,). The antenna also includes an impedance matching stub (,) electrically coupled to the radiating element (,), and means for feeding the radiating element (,), wherein the means for feeding includes a feed point (,) disposed on the impedance matching stub (,).

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Singapore, Singapore

Zhi Ning Chen