Meta Platforms Technologies, LLC

Zhenzhen Shen

Felippe Jose Pavinatto

Daniele Piazza

Priyanshu Agarwal

Tianshu Liu

Dongsuk Shin

Li Yao

Harsha Prahlad

Cameron Elliot Glasscock

Wenyang Pan

Omar Awartani

Allison Tuuri

Marcos Antonio Santana Andrade, Jr

Aleksey Reiderman

Lichuan Chen

The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.

Systems, methods, and devices for producing interconnects on deformable substrates of electronic devices

Disclosed apparatus may include a membrane, a first electrode supported by the membrane, a second electrode, and optionally a controller configured to control an electrical potential applied between the first electrode and the second electrode. Example apparatus may include one or more flexible membranes that may, at least in part, define an enclosure that is at least partially filled with a dielectric fluid. A flexible membrane may include a functionalized polymer or inorganic dielectric material, such as a fluoropolymer composite including at least one electrically conductive additive and/or at least one toughener. Examples also include associated materials (e.g., polymers), methods of fabrication, methods of apparatus operation, and systems.

Membranes with reduced resistivity

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Kirkland, WA, United States of America

Zhenzhen Shen