Creeled, Inc.

Zhenyu Zhong

Christopher P Hussell

JuZuo Sheng

Yue Kwong Lau

Solid state lighting apparatuses, systems, and related methods are provided. An example apparatus can include one or more light emitting diodes (LEDs) and a dark or black encapsulation layer surrounding and/or disposed between the one or more LEDs. The apparatus can include, e.g., a substrate or a leadframe for mounting the LEDs. A method for producing a panel of LEDs can include joining the LEDs to the panel, e.g., by bump bonding, and flooding the panel with dark or black encapsulation material so that the LED chips are surrounded by the dark or black encapsulation material.

Light emitting diodes and methods with encapsulation

Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LED packages are disclosed. Arrangements for LED packages are disclosed that provide improved reliability and improved emission characteristics in a variety of applications, including outdoor LED displays as well as general illumination. LED packages are disclosed with linear arrangements of LED chips and corresponding lenses to provide improved visibility and color mixing at higher viewing angles. LED packages are disclosed that include different types of lenses that are arranged within the same LED package depending on desired emission characteristics. Body structures for LED packages are disclosed that include arrangements for improved adhesion with encapsulant materials and optional potting materials to provide improved moisture barriers.

Arrangements for light emitting diode packages

Light-emitting devices with active electrical elements and light-emitting diodes (LEDs) are disclosed. LEDs may be mounted on an active electrical element such that the LEDs are within peripheral edges of the active electrical element. Contact pads may be arranged on the active electrical element for receiving external power and communication signals for active control of the LEDs. A light-transmissive carrier may be positioned over the active electrical element and the LEDs. Electrical traces of the carrier may be configured to electrically connect with the contact pads to route external power connections and communication signals for the active electrical element. Other electrical traces of the carrier may form a touch sensing element that is electrically coupled with the active electrical element. Active electrical elements with LEDs provided thereon may form compact sizes for use as active LED pixels configured for active-matrix addressing within an LED display.

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Hong Kong, China

Zhenyu Zhong