Ningbo Sunny Opotech Co., Ltd.

Sunny Opotech North America Inc.

Other

Nanyang Technological University

Zhenyu Chen

Mingzhu Wang

Bojie Zhao

Nan Guo

Takehiko Tanaka

Feifan Chen

Heng Jiang

Zhen Huang

Zhongyu Luan

Liang Ding

Zilong Deng

Fengsheng Xi

Duanliang Cheng

Ye Wu

Yinli Fang

Zhewen Mei

Lifeng Yao

Jingfei He

Chunmei Liu

Hongde Tu

Baozhong Zhang

Yurong Wu

Qimin Mei

Lin Liu

Shuijia Chu

Xiaojuan Su

Ang Ji

Hailing Ding

Xiaodi Liu

Dongli Yuan

Siyuan Liu

Xudong Wu

Liao Jing

Qi Wang

Kailun Zhou

QiMin Mei

Gih Keong Lau

Chuangui Zhu

Jiayao Que

Wenjie Wang

Xiaoyang Sun

Qianyou Huang

Enlai Xiang

Yafei Wang

Zhong Deng

Nyok Boon Chong

Cheng Yi Lim

Jianlong Zhang

Hui Qiu

The present application provides a photosensitive assembly, comprising: a photosensitive chip, having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region; an electronic element arranged around the photosensitive chip; a molded portion formed by a molding process and packaging the electronic element and the photosensitive chip together, the molded portion having a third surface flush with the first surface; and a first re-wiring layer formed on a non-photosensitive region of the first surface and on the third surface, a pad of the photosensitive chip being electrically connected to the electronic element through the first re-wiring layer, wherein a side surface or a bottom surface of the photosensitive assembly has a conductive region, and the conductive region is electrically connected to the first re-wiring layer. The present application further provides a corresponding manufacturing method of photosensitive assembly. The present application can reduce design limitations of the photosensitive assembly; and make camera modules in mobile terminals more modularized and easy to replace.

Photosensitive assembly and manufacturing method thereof

The present disclosure provides a camera apparatus, an SMA driving device and a manufacturing method, a driving method and a wiring method, wherein the SMA driving device further comprises a lens carrier, at least one upgoing driver, and at least one downgoing driver; wherein the lens carrier is connected to the upgoing driver, and the upgoing driver supports the lens carrier upwardly in a thermally driven manner, and pulls the lens carrier to move upward; wherein the lens carrier is connected to the downgoing driver, and the downgoing driver draws the lens carrier downwardly in a thermally driven manner, and pulls the lens carrier to move downward; and wherein the lens is disposed on the lens carrier of the SMA driving device, and the SMA driving device drives the lens to move up and down, thereby improving the focusing speed of the lens.

Camera apparatus, SMA driving device and manufacturing method, driving method and wiring method thereof

A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Manufacturing method of a molded photosensitive assembly for an array imaging module

The present invention provides a terminal device, and a display screen thereof and an application thereof. The terminal device includes a terminal device body, a display screen, and a camera module. The display screen is provided with a light through hole. The camera module is located below the display screen, and has a front end. The front end of the camera module is fixedly attached to the display screen and the camera module is aligned with the light through hole of the display screen, so that light outside the display screen is received by the camera module via the light through hole.

Terminal device, and display screen and application thereof

A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.

Circuit board assembly with photosensitive element mounted to back side of circuit board

Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.

Molding photosensitive assembly, and camera module and electronic device containing molding photosensitive assembly

The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module

A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

Camera module and array camera module based on integral packaging technology

Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.

Camera module and photosensitive assembly thereof, electronic device, and manufacturing method

The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.

Array camera module and application thereof

A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.

Camera module, and photosensitive component thereof and manufacturing method therefor

A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip. The molded base is integrally combined with the photosensitive chip, the at least one resistance-capacitance device, and the expanded wiring layer.

A lens () and a camera module () and a manufacturing method thereof, wherein the lens () comprises an edge-cut lens sheet (), wherein the edge-cut lens sheet () includes at least one chord edge () and at least one circular edge (), wherein the chord edge () and the circular edge () are adjacently connected to each other, and wherein the chord edge () and the circular edge () have different curvatures, so that the lens sheet () becomes narrow and the width of the lens () become narrow, to form an ultra-narrow camera module ().

Lens, camera module and manufacturing method thereof

A terminal device having a camera module having an optical camera lens is provided. The optical camera lens includes: a lens barrel having an axis and a lens barrel side face surrounding the axis, wherein the lens barrel side face includes a first side and a second side opposite to the first side and a lens sheet set mounted in the lens barrel and including a plurality of lenses, wherein the plurality of lenses include at least one free-form lens, and the at least one free-form lens is adapted to deflect incident light toward the second side, so that an imaging plane of an optical system composed of the plurality of lens sheets is deflected toward the second side.

Terminal device with camera module having optical lens and method for assembling same

The present invention discloses a camera module with liquid lens and an image plane correction method thereof, wherein the camera module with liquid lens includes a photosensitive assembly, a lens assembly and a correction lens, and the lens assembly includes a liquid lens with adjustable focal power, the liquid lens is held in a photosensitive path of the photosensitive assembly, and the correction lens is held in the photosensitive path of the photosensitive assembly, and the correction lens is located between the liquid lens and the photosensitive assembly, the correction lens and the liquid lens of the lens assembly cooperate with each other to compensate for aberrations, so as to correct the aberration of the optical system of the camera module with liquid lens.

Camera module with liquid lens and image plane correction method thereof

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Ningbo, China

Zhenyu Chen