Applied Materials, Inc.

Purdue Research Foundation

Zhenwen Ding

Wendell Glenn Boyd, Jr

Teng-Fang Kuo

Vijay D Parkhe

Jim Zhongyi He

Christopher Sean Olsen

Xinyu Bao

Chun Yan

Andrew D Ellington

Babak Ziaie

Peter Stone

Cagri Abdullah Savran

Ping Han Hsieh

Chun-Li Chang

Teng-fang Kuo

Venkata Naga Lakshmi Rekha Patchigolla

Adam Lane

A coated chamber component comprises a body and a protective ceramic coating deposited over a surface of the body, the protective ceramic coating being amorphous and comprising about 8-20% by weight yttrium, about 20-32% by weight aluminum, and about 60-70% by weight oxygen.

Chamber component with protective ceramic coating containing yttrium, aluminum and oxygen

An electrostatic chuck comprises a ceramic body comprising an embedded electrode and a first ceramic coating on a surface of the ceramic body, wherein the first ceramic coating fills pores in the ceramic body. The electrostatic chuck further comprises a second ceramic coating on the first ceramic coating and a plurality of elliptical mesas on the second ceramic coating, the plurality of elliptical mesas having rounded edges.

Substrate support assembly with deposited surface features

Embodiments described herein provide methods and apparatus used to reduce or substantially eliminate undesirable scratches to the non-active surface of a substrate by monitoring and controlling the deflection of a substrate, and thus the contact force between the substrate and a substrate support, during substrate processing. In one embodiment a method for processing a substrate includes positioning the substrate on a patterned surface of a substrate support, where the substrate support is disposed in a processing volume of a processing chamber, applying a chucking voltage to a chucking electrode disposed in the substrate support; flowing a gas into a backside volume disposed between the substrate and the substrate support, monitoring a deflection of the substrate, and changing a chucking parameter based on the deflection of the substrate.

ESC substrate support with chucking force control

Implementations of the present disclosure generally relate to methods and apparatuses for epitaxial deposition on substrate surfaces. More particularly, implementations of the present disclosure generally relate to methods and apparatuses for surface preparation prior to epitaxial deposition. In one implementation, a method of processing a substrate is provided. The method comprises etching a surface of a silicon-containing substrate by use of a plasma etch process to form an etched surface of the silicon-containing substrate and forming an epitaxial layer on the etched surface of the silicon-containing substrate. The plasma etch process comprises flowing an etchant gas mixture comprising a fluorine-containing precursor and a hydrogen-containing precursor into a substrate-processing region of a first processing chamber and forming a plasma from the etchant gas mixture flowed into the substrate-processing region.

Cleaning method

A method of manufacturing an electrostatic chuck includes polishing a surface of a ceramic body of the electrostatic chuck to produce a polished surface and depositing a ceramic coating onto the polished surface of the ceramic body to produce a coated ceramic body. The method further includes disposing a mask over the coated ceramic coating, the mask comprising a plurality of elliptical holes and depositing a ceramic material through the plurality of elliptical holes of the mask to form a plurality of elliptical mesas on the coated ceramic body, wherein the plurality of elliptical mesas have rounded edges. The mask is then removed from the coated ceramic body and the plurality of elliptical mesas are polished.

Methods for removing contamination from a surface disposed in a substrate processing system are provided herein. In some embodiments, a method for removing contaminants from a surface includes: providing a first process gas comprising a chlorine containing gas, a hydrogen containing gas, and an inert gas to a process chamber having the surface disposed within the process chamber; igniting the first process gas to form a plasma from the first process gas; and exposing the surface to the plasma to remove contaminants from the surface. In some embodiments, the surface is an exposed surface of a process chamber component. In some embodiments, the surface is a surface of a first layer disposed atop a substrate, such as a semiconductor wafer.

Methods for removing contamination from surfaces in substrate processing systems

A reflective diffractometric hydrogel sensor includes an upper layer, including a microfluidic chamber formed from a substantially transparent material and configured to contain a solution, a reflective diffraction grating positioned within the microfluidic chamber, the diffraction grating including a plurality of hydrogel strips configured to change in dimension in response to a stimulus, each hydrogel strip having a top surface coated with a reflective material and a bottom surface in contact with the upper layer substrate, and a reflective surface below the reflective diffraction grating wherein when a coherent light is incident upon and reflected from the upper layer at an angle substantially normal to the upper layer an interference diffraction pattern results, including a first diffraction mode, a light intensity of which indicates the relative distance between the top surfaces of the plurality of hydrogel strips and the reflective surface.

Growing community of inventors

Santa Clara, CA, United States of America

Zhenwen Ding