Hon Hai Precision Industry Co., Ltd.

ZhenQi Yang

Wen He

Fujin Peng

A fastening mechanism for an LGA socket () mounted on a PCB () for nesting an IC package () includes at least one holding unit () having a base portion () connected with the PCB, a resilient arm () extended from the base and formed with a pressing head (). The head is formed with an compressing face () able to be adjusted to move in a direction vertical to the PCB and rotate round an axis vertical to the PCB to hold the IC package on the LGA socket, thereby establishing electrical engagement between the IC package and the LGA socket. With this arrangement, good position of the IC package on the LGA socket is assured and a relatively higher space over the LGA socket can be saved to arrange other components or operate adjacent components.

Growing community of inventors

Kunsan, China

ZhenQi Yang