Aac Acoustic Technologies (Shenzhen) Co., Ltd.

Aac Technologies Pte. Ltd.

Zhenkui Meng

Zhengyan Liu

Rui Guo Zhang

Kai Wang

Linlin Wang

Tingting Hong

Jinyu Zhang

Xiaohui Zhong

Yuwei Liu

ChengYen Liu

Zhengmin Benjamin Pan

Ye Zhou

The present disclosure discloses a vibration transducer including a circuit board enclosing a receiving cavity, a MEMS chip, a first vibration unit having a first vibration cavity and a second vibration unit having a second vibration cavity. A first through hole provided on the circuit board is configured to connect the receiving cavity with the first vibration cavity; a second through hole provided on the circuit board is configured to connect the receiving cavity with the second vibration cavity. The first vibration unit vibrates to cause pressure change in the first vibration cavity which is transmitted to the MEMS chip through the first through hole; the second vibration unit vibrates to cause pressure change in the second vibration cavity which is transmitted to the MEMS chip through the second through hole. The vibration transducer in the present disclosure has higher sensitivity and SNR.

Vibration transducer

The present invention provides a bone conduction microphone including a housing and a circuit board connected with the housing. The circuit board has an acoustic channel. The microphone further includes a vibration assembly forming a first conduction cavity and a second conduction cavity. The vibration assembly includes a vibration member and a frame. The frame, the vibration member and the circuit board form a first conduction cavity. The frame, the vibration member and the circuit board form a second conduction cavity. The vibration of the vibration member is conducted to one side of the vibration diaphragm, and is also conducted to the other side of the vibration diaphragm. Compared with the related art, the bone conduction microphone of the present invention can effectively improve the sensitivity and the signal to noise ratio.

Bone conduction microphone

The present invention provides a MEMS microphone, including: a base with a back cavity; and an electric capacitance system arranged on the base. The electric capacitance system includes a back plate, a first diaphragm and a second diaphragm opposite to the back plate and arranged on an upper and lower sides of the back plate. The MEMS microphone further includes an insulation layer isolating the base, the back plate, the first diaphragm and the second diaphragm, and a sealing space formed between the first diaphragm and the second diaphragm. The pressure in the sealing space is equal to an external pressure.

MEMS microphone

The present disclosure provides a bone-conduction sensor assembly. The bone-conduction sensor assembly includes a housing, a printed circuit board assembly forming a first receiving cavity together with the housing, a diaphragm accommodated in the first receiving cavity, a MEMS die and an ASIC chip mounted on the printed circuit board assembly. The MEMS die electrically connects to the ASIC chip through a bonding wire. A first weight is located on a surface of the diaphragm facing to the printed circuit board assembly. A position of the first weight has an avoiding portion corresponding to the bonding wire.

Bone-conduction sensor assembly

The invention provides a method for manufacturing a MEMS microphone, including the steps of: providing a base and preparing a first diaphragm on a first surface of the base; preparing a back plate on a surface of the first diaphragm opposite to the first surface; forming a first gap between the first diaphragm and the back plate; preparing a second diaphragm; forming a second gap between the second diaphragm and the back plate; preparing electrodes; forming a back cavity by etching the surface opposite to the first surface.

Method for manufacturing MEMS microphone

A MEMS gyroscope is provided. The MEMS gyroscope includes a weight provided with elastic assemblies at four corners thereof. The elastic assemblies are arranged in one of diagonal directions of the weight. An electronic device is also provided applying the gyroscope of the present invention.

MEMS gyroscope and electronic device including the same

The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.

A MEMS microphone, includes: a base with a back cavity; and an electric capacitance system arranged on the base. The electric capacitance system includes a back plate, a first diaphragm opposite to and arranged on one side of the back plate, and a second diaphragm arranged on the other side of the back plate. The first diaphragm and the second diaphragm keeps a distance from the back plate for forming a first insulation gap and a second insulation gap respectively. The back plate includes a plurality of through holes; the first diaphragm and the second diaphragm are circular. The MEMS microphone further includes a first support piece between the first diaphragm and the second diaphragm through the through holes. Thus, the two diaphragms are not easy to adhere to the back plate.

The invention provides a method for manufacturing a MEMS microphone. The method comprises steps of: preparing a base; forming a first diaphragm on a first surface of the base; preparing a back plate; forming a first gap between the first diaphragm and the back plate; preparing a second diaphragm opposite to the first diaphragm; forming a second gap between the second diaphragm and the back plate; preparing electrodes on the second diaphragm; forming a back cavity by etching a second surface of the base opposite to the first surface.

A photographic mask is provided in the present disclosure. The photographic mask includes a silicon-on-insulator (SOI) base and a stepped opening formed in the SOI base. The SOI base includes a silicon substrate, a median layer and a silicon layer, the median layer is arranged between the insulator substrate and the insulator layer. The stepped opening includes a first opening portion and a second opening portion, the first opening portion penetrates through the silicon layer and has a first opening area; the second opening portion at least penetrates through the silicon substrate and is aligned with the first opening portion. The second opening portion has a second opening area greater than the first opening area of the first opening portion. The present disclosure further provides a method for making a photographic mask.

Photographic mask and method for making same

A MEMS microphone, includes a base with a back cavity and a capacitor system fixed to the base. The capacitor system includes a back plate above the base and a diaphragm opposite to the back plate for forming an insulated gap. The back plate includes a body part and multiple spaced fixation parts extending from the body part, and the diaphragm includes a vibrating part and a connecting part extending from the vibrating part. An orthographic projection of the body part of the back plate along a vibration direction of the diaphragm is completely located on the diaphragm; and at least a part of an orthographic projection of the fixation parts along the vibration direction is located on the diaphragm.

Disclosed is MEMS microphone. The MEMS microphone includes a substrate and a capacitor system disposed on the substrate. The capacitor system has a back plate, a diaphragm, an insulating space formed by the back plate and the diaphragm and at least one insulating support disposed in the insulating space and connected with the back plate or the diaphragm. When the MEMS microphone is working, the insulating support engages with the diaphragm or the back plate thereby dividing the diaphragm into at least two vibrating units which improves the sensitivity and SNR of the MEMS microphone. Meanwhile, the MEMS microphone has the advantage of low cost and is easy to be fabricated.

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Shenzhen, China

Zhenkui Meng