Optiz, Inc.

Zhenhua Lu

Vage Oganesian

A sensor device includes a first substrate of semiconductor material having opposing first and second surfaces, photodetectors configured to receive light impinging on the first surface, and first contact pads each exposed at both the first and second surfaces and electrically coupled to at least one of the photodetectors. A second substrate comprises opposing first and second surfaces, electrical circuits, a second contact pads each disposed at the first surface of the second substrate and electrically coupled to at least one of the electrical circuits, and a plurality of cooling channels formed as first trenches extending into the second surface of the second substrate but not reaching the first surface of the second substrate. The first substrate second surface is mounted to the second substrate first surface such that each of the first contact pads is electrically coupled to at least one of the second contact pads.

Method of making a sensor package with cooling feature

An image sensor that includes a substrate having front and back surfaces, a plurality of photo detectors formed adjacent the front surface, a plurality of contact pads at the front surface and electrically coupled to the photo detectors, and a plurality of light manipulation components disposed on a portion of the back surface. The photo detectors are configured to generate electrical signals in response to light incident through the light manipulation components and through the portion of the back surface. The portion of the back surface has a non-planar shape.

Back side illumination image sensor with non-planar optical interface

An imaging device that includes an array of photo detectors each configured to generate an electrical signal in response to received light, and an array of color filters disposed over the array of photo detectors such that the photo detectors receive light passing through the color filters. Each of the color filters has a color transmission characteristic, which vary. To even out color balance, some of the color filters are disposed over a plurality of the photo detectors while others are disposed over only one of the photo detectors. Additional color balance can be achieved by varying the relative area sizes of the color filters and underlying photo detectors based on color transmission characteristics, to compensate for the varying absorption coefficient of the photo detectors at different colors.

Imaging device with photo detectors and color filters arranged by color transmission characteristics and absorption coefficients

A packaged chip assembly with a semiconductor substrate, a semiconductor device integrally formed on or in the substrate's top surface, and first bond pads at the substrate's top surface electrically coupled to the semiconductor device. A second substrate includes a first aperture and one or more second apertures extending therethrough, second and third bond pads at the second substrate's top and bottom surfaces, respectively, and conductors electrically coupled to the second and third bond pads. The semiconductor substrate's top surface is secured to the second substrate's bottom surface such that the semiconductor device is aligned with the first aperture, and each of the first bond pads is aligned with one of the second apertures. A plurality of wires are each electrically connected between one of the first bond pads and one of the second bond pads and each passing through one of the one or more second apertures.

Method of forming a wire bond sensor package

Sensor package with cooling feature

A sensor package that includes a substrate with opposing first and second surfaces. A plurality of photo detectors are formed on or under the first surface and configured to generate one or more signals in response to light incident on the first surface. A plurality of contact pads are formed at the first surface and are electrically coupled to the plurality of photo detectors. A plurality of holes are each formed into the second surface and extending through the substrate to one of the contact pads. Conductive leads each extend from one of the contact pads, through one of the plurality of holes, and along the second surface. The conductive leads are insulated from the substrate. One or more trenches are formed into a periphery portion of the substrate each extending from the second surface to the first surface. Insulation material covers sidewalls of the one or more trenches.

Method of forming a stress released image sensor package structure

A sensor device and method of making same that includes a silicon substrate with opposing first and second surfaces, a sensor formed at or in the first surface, a plurality of first contact pads formed at the first surface which are electrically coupled to the sensor, and a plurality of cooling channels formed as first trenches extending into the second surface but not reaching the first surface. The cooling channels instead can be formed on one or more separate substrates that are attached to the silicon substrate for cooling the silicon substrate.

Method of making low profile sensor package with cooling feature

An image sensor that comprises a first substrate and a plurality of photo detector assemblies disposed on or in the first substrate. Each of the photo detector assemblies comprises a photo detector formed on or in a second substrate and configured to generate an analog signal in response to received light, a converter formed on or in a third substrate, wherein the converter is electrically coupled to the photo detector and includes circuitry for converting the analog signal to a digital signal, a processor formed on or in a fourth substrate, wherein the processor is electrically coupled to the converter and includes circuitry for processing the digital signal.

Three dimensional system-on-chip image sensor package

Wire bond sensor package

A packaged sensor assembly and method of forming that includes a first substrate having opposing first and second surfaces and a plurality of conductive elements each extending between the first and second surfaces. A second substrate comprises opposing front and back surfaces, one or more detectors formed on or in the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors. A third substrate is mounted to the front surface to define a cavity between the third substrate and the front surface, wherein the third substrate includes a first opening extending from the cavity through the third substrate. The back surface is mounted to the first surface. A plurality of wires each extend between and electrically connecting one of the contact pads and one of the conductive elements.

Sensor package with exposed sensor array and method of making same

Stress released image sensor package structure and method

A camera module and method of making same, includes a substrate of conductive silicon having top and bottom surfaces, a sensor device, and an LED device. The substrate includes a first cavity formed into the bottom surface of the substrate and has an upper surface, an aperture extending from the first cavity upper surface to the top surface of the substrate, and a second cavity formed into the top surface of the substrate and having a lower surface. The sensor device includes at least one photodetector, is disposed at least partially in the first cavity, and is mounted to the first cavity upper surface. The LED device includes at least one light emitting diode, is disposed at least partially in the second cavity, and is mounted to the second cavity lower surface.

Growing community of inventors

East Palo Alto, CA, United States of America

Zhenhua Lu