Apple Inc.

Zhenggang Cheng

David A Secker

Sanjay Dabral

Huabo Chen

Stephen E Dey

Jeffrey A Griffis

Qianyi Zhao

Runren Zhang

Display backing components for head-mounted devices (HMDs) are described that reduce eddy currents in magnetic fields generated by a coil. A HMD may include a coil that is used to generate a magnetic field that may be used to track position of other devices with respect to the HMD. Display backing components, used to provide rigidity, are modified with holes or other gaps to interrupt the path of the eddy currents and reduce the interference with the magnetic field, thus improving the power efficiency of the coil and of the HMD. These modifications may be formed by casting, drilling, cutting or otherwise perforating the display backing during manufacture.

Display backing

Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.

High bandwidth routing for die to die interposer and on-chip applications

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Santa Clara, CA, United States of America

Zhenggang Cheng