Bemis Company, Inc.

Amcor Flexibles North America, Inc.

Zheng Tian

Otacilio Teixeira Berbert

Sam Edward Wuest

Ross K Gruetzmacher

Thomas A Schell

Desmond J Vanhouten

A recyclable film contains a base film of polyethylene that has been oriented, annealed, and irradiatively crosslinked, and a sealant. The base film has a free shrink rate of less than 10% in both the machine direction and the transverse direction when exposed to heat of 90° C. These recyclable films are ideal for use as packaging components that can be hermetically heat sealed to themselves or other packaging components, while maintaining low shrink and excellent appearance.

Recyclable films and packaging

The present invention is directed to a fracturable thermoformable packaging sheet comprising at least one thermoplastic layer having a thickness of between 10 mil and 50 mil which is composed of a polymer matrix of between 35% (wt.) to 77.5% (wt.) relative to the total weight of the thermoplastic layer of a substantially amorphous aromatic polyester. Incorporated into this polymer matrix of the at least one thermoplastic layer is an inorganic filler which is present in an amount of between 22% (wt.) to 50% (wt.) relative to the total weight of the thermoplastic layer. The inorganic filler is encased in a carrier resin which is present in an amount of between 0.5% (wt.) to 15% (wt.) relative to the total weight of the thermoplastic layer. The fracturable thermoformable packaging sheet of the present invention may be used to form thermoformed packages having a single product cavity with a snap-open tab or covering and multi-pack type packages having multiple single-serve product cavities where each individual cavities can be easily separated from each other by simply breaking the flange connecting two or more cavities. Each of these packages may optionally include a partial cut and/or crease Sine extending across a portion of the package to facilitate the snapping apart of the two sections of the package.

Modified polyester sheet having snapability

Growing community of inventors

Neenah, WI, United States of America

Zheng Tian