Fih (Hong Kong) Limited

Shenzhen Futaihong Precision Industry Co., Ltd.

Zheng Jin

Jie Ping Wu

Chang-Hai Gu

Xiao-Kai Liu

Yu-Tsai Wang

Hai-Ming Liu

Guo-Rong Huang

A housing includes a metal substrate, an adhesive layer formed on the metal substrate, and a resin film formed on the adhesive layer, the metal substrate, the adhesive layer and the resin film cooperatively form a cavity through a stamping process, an internal structure needed by the housing is formed in the cavity through an injection process, and the internal structure is formed on the resin film.

Housing, electronic device using same, and method for making same

An injection mold comprises a second die, a first die engaging with the second die, and an inclined pin. The first die defines an inclined pin hole. The inclined pin fixed in the inclined pin hole of the first die. The first die comprises a mold core on the first die. The mold core comprises two opposite ends. Each end defines a first exhaust groove. The inclined pin head comprises a second exhaust groove, a recessed portion, and a third exhaust groove. The second exhaust groove, the recessed portion, and the third exhaust groove communicate with the first exhaust groove. The injection mold further comprises a diverting groove located between the inclined pin and the first die, and a guide groove allows the third exhaust groove communicate with the diverting groove.

Injection mold having exhaust grooves

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Shenzhen, China

Zheng Jin