Hon Hai Precision Industry Co., Ltd.

Tsinghua University

Zheng-He Feng

Wen-Hua Chen

Ping-Yang Chuang

Zhan Li

Xu Gao

Yong Yan

Steven-Philip Marcher

Zhi-Jun Zhang

Xin Wang

A chipset package structure includes a carrier, a plurality of pinouts, at least one semiconductor package preforms, at least one electromagnetic shielding layer and a protective layer. The pinouts are disposed on the carrier. The semiconductor package preforms is disposed on the second surface of the carrier and electrically connected to the pinouts. The electromagnetic shielding layer is disposed on the semiconductor package preforms and the electromagnetic shielding layer. At least one of the electromagnetic shielding layers comprises a carbon nanotube film structure. The protective layer covers the electromagnetic shielding layer.

Chipset package structure

A high-impedance line includes a plurality of windings successively arranged. Each of the windings includes an upper portion and a lower portion parallel to the upper portion. The upper portions of each of the windings are electrically connected to the lower portions of adjacent windings. A resistance unit electrically connected between every two adjacent windings.

High-impedance line and detecting system having the same

A probe includes a circuit board, an electric field detecting probe, and a magnetic field detecting probe. The electric field detecting probe and the magnetic field detecting probe are located on the circuit board. An anti-jamming distance between the two detecting probes is a multiple of 5 millimeters and is greater than or equal to 10 millimeters.

Probe

A filter includes: a container; at least one barrier, an input device and an output device. The at least one barrier divide the space of the container into at least two resonant cavities. Each resonant cavity has a harmonic oscillator disposed therein. The harmonic oscillators includes a supporter and a carbon nanotube structure disposed on a surface of the supporter.

Filter

A method for measuring hearing aid compatibility (HAC) includes providing a probe and scanning testing points of a testing region obtained by the probe. The probe includes a circuit board, an electric field detecting probe, and a magnetic field detecting probe. The electric field detecting probe and the magnetic field detecting probe are located on the circuit board.

Method for measuring hearing aid compatibility

A filter includes: a container; at least one barrier, an input device and an output device. The at least one barrier divide the container into at least two resonant cavities. Each resonant cavity has a harmonic oscillators disposed therein. At least one of the harmonic oscillators comprises a supporter and a carbon nanotube structure disposed on a surface of the supporter.

A multiband antenna includes a long radiating branch, a short radiating branch, a short strip, a feed point, a grounding portion, a connecting portion, a long parasitic strip, and a short parasitic strip. The feed point, the long radiating branch, the short radiating branch, and the short strip are in a first plane. The grounding portion connects to the short strip. The connecting portion connects the long radiating branch, the short radiating branch, and the short strip. The long radiating branch, the short strip, and the connecting portion form a first inverted-L shaped antenna structure. The short radiating branch, the short strip, and the connecting portion form a second inverted-L shaped antenna structure. The long parasitic strip and the short parasitic strip are in a second plane and respectively connected to the grounding portion. The first plane is parallel to the second plane.

Growing community of inventors

Beijing, China

Zheng-He Feng