Taiwan Semiconductor Manufacturing Comp. Ltd.

Zheng-Gang Tsai

Chung-Shi Liu

Hao-Yi Tsai

Chih-Hao Chang

Yu-Chih Huang

Shih-Wei Chen

Chia-Hung Liu

Po-Chun Lin

Chun-Ti Lu

A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern. The conductive vias extend through the molded semiconductor device and are electrically connected with the redistribution pattern.

Semiconductor package and manufacturing method thereof

Growing community of inventors

Hsinchu, Taiwan

Zheng-Gang Tsai