Elite Electronic Material (Kunshan) Co., Ltd.

Elite Material Co., Ltd.

Zhenfang Shang

Rongtao Wang

Ningning Jia

Chen-Yu Hsieh

Yan Zhang

Ziqian Ma

Xingxing Yao

Mingsheng Yuan

Bingbing Li

Weimiao Yu

A resin composition includes a polyphenylene ether resin of Formula (1) and an additive. The additive may include maleimide resin, unsaturated C═C double bond-containing crosslinking agent, polyolefin, flame retardant, filler, curing accelerator, or a combination thereof. An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including comparative tracking index, breakdown voltage, dissipation factor and copper foil peeling strength.

Resin composition and article made therefrom

A resin composition includes 100 parts by weight of an unsaturated C&#x2550;C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations. 

Provided is a resin composition and articles made therefrom, wherein the resin composition comprises 40 to 80 parts by weight of maleimide monomer and/or resin; 10 to 30 parts by weight of oxydianiline type benzoxazine monomer and/or resin; 10 to 40 parts by weight of flame retardant; wherein the flame retardant comprises one or more of a flame retardant having a thermal decomposition temperature of greater than 380&#xb0; C., a metal phosphinate flame retardant and bis(pentabromophenyl) ethane; and wherein the metal of the metal phosphinate flame retardant is selected from Group 13 elements. By using maleimide monomer and/or resin, oxydianiline type benzoxazine monomer and/or resin and flame retardant comprising one or more of a flame retardant having a thermal decomposition temperature of greater than 380&#xb0; C., a metal phosphinate flame retardant and bis(pentabromophenyl) ethane, the peel strength and the glass transition temperature of the laminate made from the resin composition are remarkably improved while the dissipation factor of the laminate is also decreased; therefore, the demand for high frequency and high thermal resistance circuit boards is satisfied.

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Kunshan, China

Zhenfang Shang