Fujifilm Dimatix, Inc.

Fujifilm Corporation

Intel Corporation

Dimatix, Inc.

Zhenfang Chen

Andreas Bibl

Jeffrey Birkmeyer

Paul A Hoisington

Steven Saeed Nasiri

Shinya Sugimoto

Mats G Ottosson

Mark Nepomnishy

Janusz B Liberkowski

Gregory De Brabander

Jeff Jarfa

Darren Todd Imai

Gregory DeBrabander

Stephen R Deming

Processes for forming an actuator having a curved piezoelectric membrane are disclosed. The processes utilize a profile-transferring substrate having a curved surface surrounded by a planar surface to form the curved piezoelectric membrane. The piezoelectric material used for the piezoelectric actuator is deposited on at least the curved surface of the profile-transferring substrate before the profile-transferring substrate is removed from the underside of the curved piezoelectric membrane. The resulting curved piezoelectric membrane includes grain structures that are columnar and aligned, and all or substantially all of the columnar grains are locally perpendicular to the curved surface of the piezoelectric membrane.

Forming a device having a curved piezoelectric membrane

A method of forming an actuator includes depositing a photoimageable material to form a first photoimageable layer on a piezoelectric layer; patterning the first photoimageable layer to form an aperture; and disposing a first conductive layer on the first photoimageable layer. An actuator device formed by this method includes the photoimageable material. The first conductive layer partially overlies the first photoimageable layer such that a first portion of the first conductive layer contacts the first photoimageable layer and a second portion of the first conductive layer electrically contacts the piezoelectric layer in the aperture.

Actuators and methods of making the same

Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.

Print head nozzle formation

A fluid ejection module includes a flow-path body, a first oxide layer, a membrane, and a second oxide layer. The flow-path body has a first outer surface and an opposing second outer surface and a plurality of flow paths, each flow path extending at least from the first outer surface to the second outer surface. The first oxide layer coats at least an interior surface of each of the flow paths and the first and second outer surfaces of the flow-path body and has a thickness that varies by less than 5% along {100} planes. The membrane has a first outer surface. The second oxide layer is coated on the first outer surface of the membrane and has a thickness that varies by less than 5% along {100} planes and is bonded to the first oxide layer.

Thermal oxide coating on a fluid ejector

Techniques are described for forming actuators having piezoelectric material. A block of piezoelectric material is bonded to a transfer substrate. The block is then polished. The polished surface is bonded to a MEMS body.

Method for forming a MEMS

A method of etching a silicon substrate is described. The method includes bonding a first silicon substrate to a sacrificial silicon substrate. The first silicon substrate is etched. A pressure is applied at an interface of the first silicon substrate and the sacrificial silicon substrate to cause the first silicon substrate to separate from the sacrificial silicon substrate. An apparatus having metal blades can be used to separate the substrates.

Sacrificial substrate for etching

A microfabricated device and method for forming a microfabricated device are described. A thin membrane including silicon is formed on a silicon body by bonding a silicon-on-insulator substrate to a silicon substrate. The handle and insulator layers of the silicon-on-insulator substrate are removed, leaving a thin membrane of silicon bonded to a silicon body such that no intervening layer of insulator material remains between the membrane and the body. A piezoelectric layer is bonded to the membrane.

Print head with thin membrane

Optical fibers are inserted and bonded in a two dimensional array of feedthroughs provided by an insert having a top plate, a bottom plate and a sandwiched spacer plate. Top and bottom plate feature funnel shaped hole sections that capture the approaching fiber end during its insertion. The funnel sections terminate in narrow hole sections that tightly hold the inserted fiber ends. Having top and bottom plate spaced apart provides for high angular precision of the bonded fiber ends with minimal fabrication effort of the insert. Optical fibers may be combined in linear arrays and simultaneously inserted significantly reducing assembly efforts. The insert is attached to a fiber housing and hermetically sealed within an external housing, which features a glass plate to provide beam propagation to and from the fiber ends. An optical gel fills the gap between the insert's output face and the glass plate.

Growing community of inventors

Cupertino, CA, United States of America

Zhenfang Chen