Huawei Technologies Co., Limited

Honor Device Co., Ltd.

Zhendong Luo

Sheng Li

Jianwen Wang

Weichih Lin

Guanghai Wang

Cunying Li

Lifeng Fu

Kun Ran

Qingshan Tian

Changfu Huang

Atsushi Yajima

A terminal includes a substrate and a photosensitive chip mounted on the substrate, where a side of the photosensitive chip away from the substrate has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the photosensitive chip is electrically connected to the substrate by using a metal wire; and the photosensitive chip package structure further includes: a frame, disposed on the side of the photosensitive chip away from the substrate, where an avoidance groove used to avoid the metal wire is disposed on a side of the frame facing the substrate, the avoidance groove extends along a side edge of the frame, and an inner wall of the avoidance groove is an arc-shaped inner wall; and a filling glue, filled in the avoidance groove, and used to wrap the metal wire and bond the frame to the non-photosensitive area of the photosensitive chip and the substrate.

Photosensitive chip package structure, camera module, and mobile terminal

A camera substrate assembly, a camera apparatus, and a terminal device, where the camera substrate assembly includes a rigid support plate and a printed circuit board laminated, where at least two mounting holes for accommodating camera chips are disposed on the printed circuit board, the rigid support plate has mounting surfaces facing the mounting holes respectively and are configured to support the camera chips, strength of the rigid support plate is greater than strength of the printed circuit board, and flatness of the mounting surfaces is less than a specified threshold. The mounting holes disposed on the printed circuit board and the mounting surfaces disposed on the rigid support plate are used to support cameras. This avoids impact of warpage on camera mounting when the printed circuit board and a flexible circuit board are laminated, and improves flatness after camera mounting.

Camera substrate assembly, camera module, and terminal device

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