Shenzhen Crastal Technology Co., Ltd.

Buydeem Technology (shenzhen) Co., Ltd

Huawei Technologies Co., Limited

Vivo Mobile Communication Co., Ltd.

Shenzhen Buydeem Technology Co.

Zte Corporation

Zhen Sun

Shuai Li

Xue Li

Linfang Jin

Wei Zhao

George Mohan Zhang

GeorgeMohan Zhang

Yanxin Lu

Chijing Ni

Mohan Zhang

Jie Yang

Jian Shi

Yuping Hong

Huajin Chen

Yongfu Sun

Zhen Fang

Chiing Ni

Zhen Lu

Zhilin Peng

Xinyang Shangguan

Qingsong Xu

Electric rice cooker

Cassette furnace

Fish dish

Air fryer

Non-stick milk pan

A wireless earphone, a wireless earphone box, and a wireless earphone device. The wireless earphone includes a first body and a second body. A first end face of the first body is provided with a first magnetic member. A second end face of the second body is provided with a second magnetic member. An outer surface of the second body is provided with a third contact. The second body includes a first battery. The third contact is energized to cause the first body and the second body to be in a connected state or separated state.

Wireless earphone, wireless earphone box, and wireless earphone device

Straw cup

Hot pot

Vacuum bottle

Frying pan

Steam pot

Electric saucepan

A heat dissipation apparatus is provided. The heat dissipation apparatus includes a thermally conductive housing. The heat dissipation apparatus is connectable to a chip so that the chip is arrangeable on a chip placement region of the thermally conductive housing. A capillary structure is disposed on the thermally conductive housing and a working medium is placed in the capillary structure. The capillary structure includes a first capillary structure and a second capillary structure that are connected, and a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure.

Heat dissipation apparatus, circuit board, and electronic device

Growing community of inventors

Shenzhen, China

Zhen Sun