Ningbo Sunny Opotech Co., Ltd.

State Grid Corporation of China

State Grid Zhejiang Electric Power Co., Ltd. Taizhou Power Supply Company

Taizhou Power Supply Company of State Grid Zhejiang Electric Power

Other

North China Electric Power University

Zhen Huang

Bojie Zhao

Mingzhu Wang

Nan Guo

Takehiko Tanaka

Zhenyu Chen

Zhongyu Luan

Feifan Chen

Heng Jiang

Li Liu

Fengsheng Xi

Duanliang Cheng

Chenxiang Xu

Liang Ding

Zhewen Mei

Zilong Deng

Jiawei Chen

Zongchun Yang

Qimin Mei

Ye Wu

Jingfei He

Bo Peng

Baozhong Zhang

Guode Ying

Yuande Zheng

Chi Zhang

Tao Zhu

Kang Wang

Hua Xu

Ping Zhao

Zaibing Zhou

Jian Wu

Dongli Yuan

Hao Tan

Xinxiang Sun

Bin Lu

QiMin Mei

Hao Li

Tinghua Li

Hongfeng Gan

Xiaotong Zhu

Qingchun Zhao

Xiaochun Xu

Ben Li

Yutao Qiu

Yiping Shen

Xiaodi Liu

Lifeng Yao

Dongbo Zhang

Liefeng Chen

Chengchang Zheng

Junjie Zeng

Yifan Zhu

Daojian Hong

Tao Zheng

Chen Zhou

Sisi Yu

Xu Jiang

Yinbo Zhang

Minzhi Chen

Wenqi He

Linmin Ye

Chao Hong

Qiang Fu

Jiayao Que

Kai Chen

Fengyuan Wang

Yudong Fang

Chenjing Xu

Xiaoping Fu

Mingxu Chen

Lifeng Kan

Zheng Qin

Rijun Wang

Yinhuan Wang

Disclosed is a camera module, which uses a new piezoelectric actuator as a driving element to meet the driving requirement of the camera module. Specifically, the camera module uses the new piezoelectric actuator as the driving element to move an optical camera lens for optical image stabilization. Moreover, the piezoelectric actuator is arranged in the camera module in a rational arrangement scheme, so as to meet both the structural design requirement and the dimensional design requirement of the camera module.

Camera module having driving assembly

The present application relates to a circuit board assembly, a photosensitive assembly, a camera module, and preparation methods for the circuit board assembly and the photosensitive assembly. The photosensitive assembly includes a circuit board and a photosensitive chip. The circuit board includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on the lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium. The photosensitive chip includes chip electrical connecting terminals disposed in a non-photosensitive area. The chip electrical connecting terminals of the photosensitive chip is in contact with the conducting medium to be electrically connected to the circuit board electrical connecting terminals, and the photosensitive chip is bonded to the lower surface of the circuit board via the non-conducting adhesive, so that the photosensitive chip is electrically connected to the circuit board. In this way, the photosensitive chip is stably electrically connected to the circuit board with relatively low costs and relatively low process difficulty.

Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assembly

A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

Camera module and photosensitive assembly thereof

Disclosed are a molded circuit board and a camera module, and a manufacturing method thereof and an electronic device comprising the same. The molded circuit board includes a circuit board main body and a molded structure. The circuit board main body includes at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked in a manner of being spaced apart. The molded structure includes a molded layer, wherein the molded layer is stacked on at least one surface of the circuit board main body to cover at least part of the substrate.

Molded circuit board and camera module, and manufacturing method thereof and electronic device

The present application relates to a photosensitive assembly, a camera module and manufacturing methods therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, at least one electronic component disposed on the circuit board, and a molded body integrally formed on the circuit board. The molded body has at least one slot formed therein in a recessed manner, and the slot is located outside the photosensitive chip. In this way, the magnitude of stress that the molded body acts on the photosensitive chip is reduced by means of the slot being disposed in the molded body, so as to effectively reduce the amount of deformation of the photosensitive chip due to the stress.

Photosensitive assembly, camera module and manufacturing methods therefor

A periscopic camera module, including: a first reflective element including a first reflective surface and used to reflect incident light and make the incident light longitudinally turn; an optical lens used to receive the light reflected by the first reflective element and output an imageable light beam to an image space; a second reflective element including at least one second reflective surface and adapted to make the imageable light beam transversely turn at least once; and a photosensitive chip adapted to receive the transversely turned imageable light beam, wherein at least one of all optical surfaces of the first reflective element and the second reflective element is provided with a light blocking structure, and the light blocking structure is arranged at an edge region of the at least one optical surface; and the optical surface includes a reflective surface, an incident surface, or an exit surface. The volume of the periscopic camera module can be reduced such that the structure of the periscopic camera module is more compact, and it can be better adapted to an optical lens with a large focal length, and can reduce or avoid the risk of introduction of stray light.

Periscopic camera module and electronic device

Disclosed in the present application are a camera module, and a photosensitive assembly and a manufacturing method therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping member provided on the circuit board. A lower surface of the photosensitive chip is attached to the shaping member to form an accommodating space with the shaping member and the circuit board. The accommodating space is configured so that the photosensitive chip is bent downward during a process of assembling the photosensitive assembly. In this way, the photosensitive chip is bent into a shape adapted to the actual focal plane during the assembly process, so as to improve the imaging quality.

Camera module, and photosensitive assembly and manufacturing method therefor

A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.

Circuit board assembly with photosensitive element mounted to back side of circuit board

The present disclosure provides a circuit board assembly, a TOF camera module including the circuit board assembly and applications thereof. The circuit board assembly is used to support an electronic component, and includes a conductive portion and an insulating portion. The insulating portion is integrally bonded to the conductive portion, and the conductive portion extends through the insulating portion. The electronic component is supported by the conductive portion and is communicated with the conductive portion, so that the electronic component directly dissipates heat through the conductive portion during operation.

Circuit board assembly and semi-finished product thereof, floodlight, camera module and application thereof

The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The photosensitive chip is attached to the first surface by an adhesive, and the adhesive is at least disposed between the top surface of the protrusion structure and the bottom surface of the photosensitive chip. The metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner. The present application further provides a corresponding manufacturing method for a camera module and a photosensitive assembly. The present application can avoid or suppress the deformation of the photosensitive chip at a smaller cost of space size. The photosensitive assembly and the camera module of the present application can improve the structural strength of the circuit board. The photosensitive assembly and the camera module of the present application can improve the heat dissipation efficiency of the photosensitive chip.

Photosensitive assembly, camera module and manufacturing method thereof

Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.

Camera module and photosensitive assembly thereof, electronic device, and manufacturing method

A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.

Camera module, and photosensitive component thereof and manufacturing method therefor

A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip. The molded base is integrally combined with the photosensitive chip, the at least one resistance-capacitance device, and the expanded wiring layer.

A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.

Camera module and molded photosensitive assembly and electronic device

Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly. The second upper surface of the second molded portion is higher than the first upper surface of the first molded portion, so as to define and form an outer space by a second outer side surface of the second molded portion and the first upper surface of the first molded portion.

Camera module, molded photosensitive assembly and manufacturing method thereof, and electronic device

Growing community of inventors

Ningbo, China

Zhen Huang