Texas Instruments Corporation

Infineon Technologies Canada Inc.

Zhemin Zhang

Yi Yan

Yuki Sato

Vijaylaxmi Gumaste Khanolkar

Kenji Otake

Jeffrey Anthony Morroni

Ashutosh Ravindra Joharapurkar

Robert Martinez

Nan Xing

Yongbin Chu

Ramesh G Karpur

Yalong Li

Takafumi Ando

Marco A Zuniga

Abhishek Jain

Roberto Giampiero Massolini

Joyce Marie Mullenix

Yinglai Xia

Hiep Xuan Nguyen

Edward MacRobbie

Nicola Bertoni

Lucas Andrew Milner

Robert Wayne Mounger

Rohan Samsi

Krishnaswamy Nagaraj

Raul Blecić

Suraj Somashekara Kumar

Ashutosh Kumar

Abhisek Jain

A bidirectional current sense circuit allowing for sensing of power current passing through a power field-effect transistor, regardless of the direction of the power current. The bidirectional current sense circuit outputs a current sense signal representing the power current onto a current sense output node. The bidirectional current sense circuit includes the power field-effect transistor, and two current sense circuits. One of the current sense circuits senses the power current when the power current flows in the positive direction. The other current sense circuit senses the power current when the power current flows in the negative direction.

Bidirectional current sense for power field-effect transistor

A circuit that is capable of generating a negative voltage on a negative voltage supply node. The circuit includes a negative voltage generation circuit, an oscillator and an oscillator control signal generator. The negative voltage generation circuit generates a negative voltage on the negative voltage supply node in response to receiving a signal from the oscillator. The negative voltage generated by the negative voltage generation circuit depends upon the frequency of the signal from the oscillator. The oscillator control signal generator controls the frequency of the signal from the oscillator by sensing the negative voltage present on the negative voltage supply node, and by increasing or decreasing the frequency of the signal from the oscillator accordingly. Thus, charge is replenished to the negative voltage supply node to more closely match the drawing of charge from that negative voltage supply node, thereby more accurately generating the negative voltage.

Negative voltage generator

A circuit that includes a power transistor and at least one sense transistor and that uses the control drive terminal to not only control the power transistor and the sense transistor, but also to provide power to a current sense circuit. The control nodes of the power transistor and sense transistor are connected, and the input nodes of the power transistor and the sense transistor are also connected. The current sense circuit is connected to the sense transistor control node and is configured to detect current passing through the sense transistor. The current sense circuit is also connected to the control drive terminal and is configured to draw power from the control drive terminal when a high control signal is present on the control drive terminal. Accordingly, the current sense circuit does not require an independent fixed high voltage supply in order to operate.

Circuit with power transistor and current sense that uses control drive as power source

An electronic device includes a multilevel lamination structure having a core layer, dielectric layers and conductive features formed in metal layers on or between respective ones or pairs of the dielectric layers. The core layer and the dielectric layers extend in respective planes of orthogonal first and second directions and are stacked along an orthogonal third direction. The conductive features include a first patterned conductive feature having multiple conductive turns in each of a first pair of the metal layers to form a first winding having a first turn and a final turn adjacent to one another in the same metal layer of the first pair, and a second patterned conductive feature having multiple conductive turns in a second pair of the metal layers to form a second winding having a first turn and a final turn.

Transformer design with balanced interwinding capacitance for improved EMI performance

A packaged electronic device includes first conductive leads and second conductive leads at least partially exposed to an exterior of a package structure, and a multilevel lamination structure in the package structure. The multilevel lamination structure includes a first patterned conductive feature having multiple turns in a first level to form a first winding coupled to at least one of the first conductive leads in a first circuit, a second patterned conductive feature having multiple turns in a different level to form a second winding coupled to at least one of the second conductive leads in a second circuit isolated from the first circuit, and a conductive shield trace having multiple turns in a second level spaced apart from and between the first patterned conductive feature and the second patterned conductive feature, the conductive shield trace coupled in the first circuit.

Isolated transformer with integrated shield topology for reduced EMI

A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

Method for manufacturing an integrated transformer with printed core piece

In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

Method of manufacturing transformers with laminate windings and build-up films

A transformer respectively includes a first isolation barrier, a first inductive element, a second isolation barrier, and a second inductive element. The first isolation barrier and second isolation barrier each comprise multiple isolation layers. The transformer also includes magnetic material including a top magnetic portion disposed above the first isolation barrier. The transformer also includes a bottom magnetic portion disposed below the second inductive element; The transformer further includes an intermediary magnetic portion extending from the top magnetic portion to the bottom magnetic portion via a through-hole within the first isolation barrier, first inductive element, second isolation barrier, and second inductive element. The transformer yet further includes at least one lateral magnetic portion extending from the top magnetic portion to the bottom magnetic portion. The at least one lateral magnetic portion is disposed laterally from the first isolation barrier, first inductive element, second isolation barrier, and second inductive element.

Galvanic isolation of integrated closed magnetic path transformer with BT laminate

Transformers with build-up films

In some examples, an electronic device comprises a first magnetic member, a first adhesive layer abutting the first magnetic member, a second magnetic member, a second adhesive layer abutting the second magnetic member, and a laminate member between the first and second adhesive layers. The laminate member comprises first and second transformer coils, an electromagnetic interference (EMI) shield coil, and a set of thermally conductive members coupled to the EMI shield coil and extending in three dimensions. At least some of the thermally conductive members extend vertically through a thickness of the laminate member so as to be exposed to top and bottom surfaces of the laminate member. The electronic device includes a thermally conductive component coupled to at least one thermally conductive member in the set of thermally conductive members.

Power module with enhanced heat dissipation

Growing community of inventors

Allen, TX, United States of America

Zhemin Zhang