Hewlett Packard Enterprise Development LP

Zheila N Madanipour

Patrick A Raymond

Brian T Purcell

Vincent W Michna

Robert Allen Voss

Chandler Ray Harris

Michael Bourg

John P Franz

Wade David Vinson

William Kirk Norton

In some examples, a controller for air and liquid cooling of electrical equipment is provided. The controller can include a cooling profile assignment module to assign a hybrid cooling profile based on temperature readings of electrical equipment; an air cooling control module to control a forced airflow cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile; and a liquid cooling control module to control a liquid cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile. The assigned hybrid cooling profile can indicate that the forced airflow cooling system is to be used as a primary cooling system for the electrical equipment unless temperature readings indicate that a heat profile of the electrical equipment is above a thermal threshold.

Air and liquid cooling of electronic equipment based on a selected hybrid cooling profile

Various examples described herein provide for determining a first data input/output (I/O) type of a computing device module and a second data I/O type of an I/O switch module, where the computing device module and the I/O switch module are coupled through a backplane system that includes a retimer. In response to the first data I/O type matching the second data I/O type, a connection between the computing device module and the I/O switch module may be permitted or prevented via the retimer.

Matching data I/O types on backplane systems

According to an example, a server may include a housing including a bottom portion, a first node defined by first and second printed circuit assemblies, and a second node defined by third and fourth printed circuit assemblies.

Server

Supporting input/output (I/O) connectivity for a printed circuit assembly (PCA) in a hot aisle cabling or a cold aisle cabling arrangement includes a chassis, the chassis being connected to a rack in a data center, and a PCA slidably connected to the chassis via a tray, in which the PCA comprises a number of bill of material (BOM) options to customize the PCA and a single basic input/output system (BIOS) image, and in which the PCA is physically shifted on the chassis to accommodate a cold aisle cabling or a hot aisle cabling arrangement of the data center.

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Houston, TX, United States of America

Zheila N Madanipour