Altera Corporation

Waymo LLC

Zhe Li

Min Wang

Pierre-yves Droz

Samuel William Lenius

Jamal Izadian

Michael George Sleator

Paul Karplus

Kyla Purvis

Hui Liu

Hong Shi

Yuanlin Xie

Peter Boyle

Geping Liu

Iliya G Zamek

Kundan Chand

Wui Hung Moo

Joseph Boon Hock Kho

Chiakang Sung

Joseph Huang

Bonnie I Wang

Khai Nguyen

Pierre-Yves Droz

Qing Xu

Tony K Ngai

Stephen L Gwaltney

Kelvin Kwong

Robert J Lockwood

Shishuang Sun

Peng Ye

Lawrence David Smith

James L Drewniak

Sandeep Kamalakar Reddy Chandra

Bozidar Krsnik

Xiaohe Chen

William Martin Peters, Jr

Chia-Hung Lin

Craig Moriwaki

A vehicle having a communication system is disclosed. The system includes two electrical couplings, coupled by way of a rotary joint having a bearing waveguide. Each electrical coupling includes an interface waveguide configured to couple to external signals. Each electrical coupling also includes a waveguide section configured to propagate electromagnetic signals between the interface waveguide and the bearing waveguide of the rotary joint. Additionally, the rotary joint is configured to allow one electrical coupling to rotate with respect to the other electrical coupling. An axis of rotation of the rotary joint is defined by a center of a portion of the waveguides. Yet further, the rotary joint allows electromagnetic energy to propagate between the waveguides of the electrical couplings.

Waveguide apparatus with high speed dual channel wireless contactless rotary joint

A rotary joint includes a shaft having a first end, a second end, and a cavity. The rotary joint includes a first waveguide section having a first proximal end and a first distal end. The first proximal end of the first waveguide section is positioned within the cavity and secured to the inner surface of the shaft. The rotary joint includes a second waveguide section that includes a second proximal end and a second distal end. The second proximal end of the second waveguide section is positioned within the cavity of the shaft and unsecured to the inner surface of the shaft to form a radial gap between an outer surface of the second proximal end and a laterally adjacent portion of the inner surface of the shaft. The shaft and the first waveguide section are configured to rotate about the rotational axis and relative to the second waveguide section.

Broadband rotary joint for millimeter wave transmission

A communication system is disclosed. The system can include a first communication unit including a first antenna, a second communication unit including a second antenna and a dielectric waveguide cable, and a rotary joint configured to enable the first unit to rotate with respect to the second unit about an axis of rotation of the system. The dielectric waveguide cable can extend from the second antenna to the rotary joint, where a proximal end of the cable can be coupled to the second antenna and a distal end of the cable can be affixed to the second unit at a location bordering a space defined by the rotary joint. The first and second units can be configured to engage in two-way communication with each other. An axis of the distal end of the cable can be substantially aligned with the axis of rotation of the system.

Automotive communication system with dielectric waveguide cable and wireless contactless rotary joint

Radar system for use in a vehicle comprising a rotary joint where a non-rotational unit is fixed to the vehicle and a rotational unit includes antennas configured for use with radar signals

Communication system for LIDAR sensors used in a vehicle comprising a rotary joint with a bearing waveguide for coupling signals with communication chips

A vehicle having a communication system is disclosed. The system includes two electrical couplings, coupled by way of a rotary joint. Each electrical coupling includes an interface waveguide configured to couple to external signals. Each electrical coupling also includes a waveguide section configured to propagate electromagnetic signals between the interface waveguide and the rotary joint. Additionally, the rotary joint is configured to allow one electrical coupling to rotate with respect to the other electrical coupling. An axis of rotation of the rotary joint is defined by a center of a portion of the waveguides. Yet further, the rotary joint allows electromagnetic energy to propagate between the waveguides of the electrical couplings.

Communication system for a vehicle comprising a dual channel rotary joint coupled to a plurality of interface waveguides for coupling electromagnetic signals between plural communication chips

A computer implemented method for determining a timing variation for an edge of a waveform under simultaneous switching noise (SSN) conditions is provided. The method includes characterizing an impact of mutual inductive relationships on a pin while the pin is at a quiet state and characterizing a signal edge applied to the pin. The signal edge can be characterized by the slew rate in one embodiment. A voltage change related to a curve characterizing the impact of mutual inductive relationships is identified and the voltage change is applied to a curve characterizing an impact of SSN on the signal edge. The method includes calculating a timing variation correlated to the voltage change applied to the curve characterizing the impact of SSN on the signal edge and presenting the calculated timing variation.

Method and system for calculating timing variations considering simultaneous switching noise

An integrated circuit package with embedded passive structures may include first and second integrated circuit dies that are surrounded by capacitor structures. A molding compound is deposited to encapsulate the integrated circuit dies and the capacitor structures. The molding compound is then attached to a redistribution wafer, in which the integrated circuit dies and the capacitor structures are electrically connected to metal routing layers of the redistribution wafer. A conductive layer is subsequently formed over the first integrated circuit die in the molding compound. The conductive layer is made up of additional metal routing layers and inductor structures. The integrated circuit package may further include a group of conductive vias that is formed in the molding compound. Each conductive via has a first end contacting the metal routing layers of the distribution wafer, and a second end contacting the conductive layer.

Integrated circuit package with embedded passive structures

A method of forming an integrated circuit package may include forming a first layer of a package substrate and mounting an interposer structure on the first layer of a substrate. In some instances, adhesive is used to attach the interposer structure to the first layer of the substrate. After the interposer structure is mounted on the first layer of the substrate, at least one hole is formed through the interposer structure. The hole may be filled with a conductive material such as copper to form a through-hole via in the interposer structure. A second layer of the substrate may be formed over the interposer structure and the first layer of the substrate. Integrated circuit (IC) dies may be mounted on the substrate and signals may be routed between the IC dies via the interposer structure embedded in the substrate.

Embedded interposer with through-hole vias

An integrated circuit in a multi-chip package is provided. The integrated circuit may include adjustable interface circuitry configured to interface with other off-chip components. In particular, the adjustable interface circuitry may include a microbump input-output buffer operable to drive signals off of the integrated circuit and operable to receive signals from other integrated circuits in the multi-chip package via a microbump. The microbump input-output buffer may include output buffers and input buffers. The output buffers may have programmable drive strengths and may each be selectively switched in and out of use depending on the desired application. Each output buffer may include a level shifter, a buffer circuit, and multiple inverter-like circuits each of which can be turned on or off to adjust the drive strength of that output buffer.

Adjustable drive strength input-output buffer circuitry

A power distribution network comprises an interposer and a package substrate, each of which has a major upper surface and a major lower surface substantially parallel to the upper surface. A single copper island is formed on the lower surface of the interposer opposite and substantially co-extensive with a single copper island formed on the upper surface of the package substrate. A plurality of leads extend from the copper island on the lower surface of the interposer, each lead coupling to a different silicon through via that extends through the interposer to the upper surface of the interposer. This structure has significant improvements in performance and cost over prior art structures.

Transceiver power distribution network

Embodiments disclosed herein relate to apparatus and methods of transceiver power noise reduction. One embodiment relates to a method of serial data communication. At a transmitter, data may be encoded by a communication protocol encoder, and the protocol-encoded data may be serialized. The serialized data may be encoded for power-delivery-network noise reduction (PNR) so as to generate PNR-encoded serial data, and the PNR-encoded serial data may be driven onto a communication channel. Other embodiments, aspects, and features are also disclosed.

Methods and apparatus for transceiver power noise reduction

Growing community of inventors

San Jose, CA, United States of America

Zhe Li