Asm Technology Singapore Pte Ltd

Zhao Yang

Kui Kam Lam

Jun Qi

Chun Hung Samuel Ip

Pingliang Tu

A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

Growing community of inventors

Chengdu, China

Zhao Yang