Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Hefei Boe Display Technology Co., Ltd.

Zhanfeng Cao

Qi Yao

Ke Fei Wang

Zhiwei Liang

Yingwei Liu

Feng Zhang

Guangcai Yuan

Haixu Li

Bin Zhang

Zhengliang Li

Xiaolong He

Muxin Di

Ke Wang

Shengguang Ban

Jincheng Gao

Xue Dong

Xiangchun Kong

Wei Zhang

Jianguo Wang

Shi Shu

Feng Guan

Dapeng Xue

Zhijun Lv

Qi Qi

Xinhong Lu

Guoqiang Wang

Jiushi Wang

Luke Ding

Shuilang Dong

Zhen Liu

Lei Chen

Ce Ning

Renquan Gu

Xuefei Sun

Huijuan Wang

Fei Wang

Seongyeol Yoo

Wusheng Li

Guanbao Hui

Xiaoyan Zhu

Dongni Liu

Wei Xu

Yanan Niu

Lizhong Wang

Wenlin Zhang

Chenyang Zhang

Tingting Zhou

Xuan Liang

Lei Wang

Minghua Xuan

Feng Qu

Yanling Han

Fuqiang Li

Kuanjun Peng

Hongwei Tian

Ting Zeng

Meili Wang

Xiaoxin Song

Nianqi Yao

Qingzhao Liu

Jingxia Gu

Chen Hui Xu

Jing Li

Zhi Hu Wang

Dongfang Wang

Han Yue

Wei Yang

Bin Zhou

Youngsuk Song

Xiao Lin Zhang

Liangchen Yan

Seungjin Choi

Chuanxiang Xu

Yafeng Yang

Xin Gu

Haifeng Hu

Peng Xu

Song Liu

Ce Zhao

Lei Zhao

Kun Zhao

Hehe Hu

Jianshe Xue

Fangzhen Zhang

Bing Jiang Sun

Jiaxiang Zhang

Jikai Yao

Huan Liu

Jingang Fang

Yichi Zhang

Jian Yang

Yu Jiang

Yapeng Li

Yucheng Chan

Zhiyong Liu

Jintao Peng

Jie Huang

Shuang Sun

Chen Tang

Xue Jiang

An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer. The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.

Array substrate and manufacturing method therefor, display panel, and backlight module

A circuit board includes a substrate, a first conductive layer, a first insulating layer and a second conductive layer. The first conductive layer includes a plurality of first conductive portions. The second conductive layer includes a plurality of second conductive portions. A second conductive portion passes through a first via hole in the first insulating layer to be in electrical contact with a first conductive portion. The first conductive layer and the second conductive layer each include at least one main conductive layer, which is capable of creating a first intermetallic compound with solder. At least one of the first conductive layer and the second conductive layer further includes a stop layer capable of creating a second intermetallic compound with the solder. A rate of a reaction between the stop layer and the solder is lower than a rate of a reaction between the main conductive layer and the solder.

Circuit board, light-emitting substrate, backlight module, and display apparatus

A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a chip arranged on the base substrate, wherein the chip includes a chip main body and a plurality of terminals arranged on the chip main body; a terminal expansion layer arranged on the base substrate, the terminal expansion layer including a conductive material, and the terminal expansion layer and at least one terminal are located on a same side of the chip main body; and a plurality of expansion wires in the terminal expansion layer, wherein the plurality of expansion wires are electrically connected to the plurality of terminals, respectively, to lead out the plurality of terminals, wherein an orthographic projection of at least one expansion wire on the base substrate completely covers an orthographic projection of a terminal electrically connected to the expansion wire on the base substrate.

Semiconductor apparatus and method for manufacturing the same

A back plate and a manufacturing method thereof, a method for bonding a chip, and a display device are provided. The back plate includes: a base substrate; and, a plurality of conductive connecting tubes disposed on the base substrate, wherein one end of each of the conductive connecting tubes is connected to the base substrate, and a side wall of each of the conductive connecting tubes is provided with an opening penetrating the side wall. And, the method for bonding a chip includes: providing the back plate; inserting an electrode of the chip into a corresponding conductive connecting tube from an end of the conductive connecting tube away from the base substrate; and heating the conductive connecting tube and the chip, so that the electrode of the chip is electrically connected to the conductive connecting tube.

Back plate and manufacturing method thereof, method for bonding chip, and display device

A substrate includes: a base substrate; an organic layer on the base substrate with openings defined through the organic layer; a first metal layer including first metal patterns, where the first metal pattern is in the opening, and includes a first portion parallel to a bottom of the opening and a second portion parallel to a lateral wall of the opening; a second metal layer having a thickness greater than a thickness of the first metal layer; where the second metal layer includes second metal patterns, the second metal pattern is located in the opening and is in contact with the first metal layer; and, a distance from a surface of the first metal layer away from the base substrate to a plane where the base substrate is located is smaller than a distance from a surface of the organic layer away from the base substrate to the plane.

Substrate and method for manufacturing the same, and display panel

A color filter, a preparation method therefore, an array substrate and a display device are provided. The color filter includes a plurality of filter units () provided on a base substrate () for transmitting light of different colors, and a light shielding layer () located between adjacent filter units () for transmitting light of different colors. The filter unit () includes a first surface facing the base substrate (), a second surface facing away from the base substrate, and a third surface connecting the first surface and the second surface. The light shielding layer () is provided on the third surface of at least one of two adjacent filter units () transmitting light of different colors.

Color filter and preparation method therefor, array substrate and display device

Embodiments of the present disclosure provide an intermediate substrate, including: a first substrate; a black photoresist layer on a side of the first substrate; and a plurality of light emitting devices on a side of the black photoresist layer away from the first substrate. Each of the plurality of light emitting devices has a light-exiting side for emergence of light emitted by the light emitting device, the light-exiting side is in contact with the black photoresist layer, and the light emitting device includes a driving electrode for introducing a driving signal.

Intermediate substrate and fabrication method of display panel

A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.

Display panel, manufacturing method thereof, and display device

An array substrate includes a base substrate, a driving circuit layer, and a functional device layer which are sequentially stacked; the driving circuit layer is provided with first driving circuits, and each first driving circuit at least includes a driving transistor; and the driving circuit layer includes a first gate layer, a first gate insulation layer, a semiconductor layer, a second gate insulation layer, a second gate layer, an interlayer dielectric layer, and a source-drain metal layer which are sequentially stacked on one side of the base substrate.

Array substrate and display panel including electrically connected gates

A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

Display backboard and manufacturing method thereof and display device

The present disclosure provides a substrate integrated with a passive device and a method for manufacturing the same. The method includes: providing and processing a transparent dielectric layer to obtain the transparent dielectric layer provided with a first connection via therein, with the transparent dielectric layer including a first surface and a second surface which are disposed oppositely; and integrating a passive device, which includes at least an inductor, on the transparent dielectric layer. The integrating a passive device on the transparent dielectric layer includes: forming a first sub-structure on the first surface of the transparent dielectric layer, forming a second sub-structure on the second surface of the transparent dielectric layer, and forming a first connection electrode in the first connection via; and the first sub-structure, the first connection electrode and the second sub-structure are connected to form a coil structure of the inductor.

Substrate integrated with passive device and method for manufacturing the same

Disclosed are a connecting substrate and a fabrication method, a splicing screen, and a display apparatus. The connecting substrate has panel areas () and connecting areas () connecting every two adjacent panel areas (), each panel area including a display area () surrounded by the connecting areas (). The connecting substrate includes, in connecting area: a base (); connecting wirings () on the base (); an insulating layer () covering the plurality of connecting wirings () and defining a groove () for accommodating a display panel () to be spliced; through holes () penetrating the insulating layer (); and connecting electrodes () respectively provided in the through holes () and coupled to the connecting wirings () in one-to-one correspondence. The connecting electrodes () are coupled to first pads (P) on light-emitting surface of the display panel () to be spliced in one-to-one correspondence.

Connecting substrate, fabrication method, splicing screen and display apparatus

A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base substrate each including a chip main body and a plurality of terminals arranged thereon; a plurality of fixed connection portions arranged on the base substrate, and adjacent to the plurality of chips; a terminal expansion layer arranged on the base substrate; and a plurality of expansion wires in the terminal expansion layer and configured to electrically connect the chips, wherein an expansion wire configured to electrically connect two chips includes at least a first wire segment and a second wire segment, and the first wire segment is configured to electrically connect a terminal of a chip and a fixed connection portion adjacent to the chip, and the second wire segment is configured to connect two fixed connection portions between the two chips.

Semiconductor apparatus having expansion wires for electrically connecting chips

A substrate, a backlight module, and a display apparatus, which relates to the technical field of display. The substrate is configured to display or provide a backlight, and the substrate includes: a bonding region (OB) and a plurality of light-emitting regions (OA); each of the plurality of light-emitting regions (OA) includes a first metal layer () and a first conductive adhesive () located on the first metal layer (), the first conductive adhesive () is a photo-curing conductive adhesive; and the bonding region (OB) includes a second metal layer () and a second conductive adhesive () located on the second metal layer ().

Substrate, backlight module, and display apparatus

A driving backplane, a display panel and a display apparatus are provided. The driving backplane includes: a base substrate, and a plurality of connection electrode groups and a plurality of correction structures disposed on the base substrate, each of the connection electrode groups includes: a first connection electrode and a second connection electrode the first connection electrode and the second connection electrode are arranged on a same layer; a first gap is formed between the first connection electrode and the second connection electrode, and a first group of opposite edges includes: an edge, close to the first gap, of the first connection electrode; and an edge, close to the first gap, of the second connection electrode; a second group of opposite edges includes: an edge, far away from the first gap, of the first connection electrode; and an edge, far away from the first gap, of the second connection electrode.

Driving backplane, display panel and display apparatus

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Beijing, China

Zhanfeng Cao