Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Huawei Technologies Co., Limited

Fu Zhun Prexision Industry (shan Zhen) Co., Ltd.

Zhan Wu

Shi-Wen Zhou

Chun-Chi Chen

Hsieh-Kun Lee

Lin Xiao

Guo Chen

Jun Cao

Jianjun Zhou

Bing-Wen Zhou

Hong-Wei Du

This application provides a data processing method and a related device, to keep data consistency between a management device and a forwarder in a multi-head management scenario. The method performed by a first management device in the plurality of management devices includes: sending a lock instruction to the forwarder; performing difference comparison between target data of the first management device and corresponding data that is on the forwarder and that corresponds to the target data to obtain a comparison result; and synchronizing the target data with the corresponding data if the first management device determines, by using the comparison result, that the target data and the corresponding data do not match, so that the target data matches the corresponding data.

Packet transmission method and apparatus

A multi-service node management system includes: at least two service nodes, where each of the service node is disposed with a baseboard management controller (BMC); a module management controller (MMC), having one end configured to perform data communication with the BMC in each service node of the at least two service nodes, and the other end performing data communication with a shared module; and the shared module, on which sharing management is performed by BMCs in the service nodes through an MMC.

Multi-service node management system, device and method

A heat dissipation device includes a first base plate (), a fin group () arranged on the first base plate, a first heat pipe () attached on the first base plate and the fin group and a second heat pipe () attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.

Heat dissipation device with heat pipes

A heat dissipation device () includes a heat sink (), a fan (), and an air cooling member (). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.

Heat dissipation device

A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting member. The actuating member is pivotable relative to the hook plate in a first direction so that the actuating member is turnable relative to the hook plate between a locked position and an unlocked position. Furthermore, the actuating member is turnable about an axis of the connecting member in a second direction different from the first direction.

Clip for heat sink

A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.

Clip for heat dissipation device

A heat dissipation device () includes a heat sink (), a fan (), and a cooling member (). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.

A heat sink assembly includes a heat spreader (), a plurality of fins () extending from the spreader, fasteners () and securement sleeves () fixed to the fasteners. The fastener includes a head () and a shaft () having a threaded bottom end (). The sleeve comprises a cylindrical wall (), an upper open end () and a lower open end (). The sleeve further has an annular pedestal () perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring () is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.

Heat sink assembly

A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped portion, respectively. The base is for contacting with a heat generating electronic device and transferring heat from the electronic device to the heat pipe and the fin set. The fin set defines a passageway in a middle of thereof. The U-shaped portion of the heat pipe is received in the passageway of the fin set and thermally engages with the fin set.

Heat dissipation device with heat pipe

A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.

Heat dissipation device with a heat pipe

Fastener for a heat sink and fan assembly

A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a periphery of the central portion. Each of the fins branches a plurality of portions at an end thereof. The heat conducting body includes a column thermally fitted in the through hole of the central portion of the heat dissipation body. A cavity is defined between the column and the central portion of the heat dissipation body. The cavity contains a phase-changeable medium therein, which becomes vapor once the column absorbs heat from a heat-generating electronic device.

Growing community of inventors

Shenzhen, China

Zhan Wu