International Business Machines Corporation

Zexin Luo

WeiFeng Zhang

Tao Song

Zhen Wang

XiYuan Yin

LiCen Mu

Jia Yu Zheng

Zhipeng Wang

Michael Benosa Monjardin

Jiayu Zheng

Mingman Li

Lingle Guo

Yuhua Luo

System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.

Image conduction apparatus for soldering inner void analysis

Technical solutions are described for testing a light emitting diode (LED) device. An example method includes driving, by a controller, a filter unit to filter a light from the LED device using a first filter. The method further includes, in response to a sensor not receiving a measurable signal because of the first filter, driving, by the controller, the filter unit to filter the light using a second filter. Further, in response to the sensor not receiving the measureable signal because of the second filter, the method includes outputting an indication that the LED device is rejected. Further, in response to the sensor receiving the measureable signal, the method includes outputting an indication that the LED device is of a color representative of the second filter.

Light emitting diode color resolution testing

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Shenzhen, China

Zexin Luo