Renesas Electronics Corporation

Zenzo Suzuki

Katsumi Dosaka

Michitaka Kimura

An image pickup apparatus that makes it possible to achieve both high picture quality and a wide dynamic range is provided. Each pixel unit included in the image pickup apparatus includes: four photodiodes; four transfer transistors; a charge storage portion (four floating diffusions) for storing electric charges generated at the photodiodes; an amplification transistor; a select transistor; and a reset transistor. The image pickup apparatus further includes multiple coupling transistors. Each coupling transistor couples together the charge storage portions of two pixel units of the pixel units. A scanning circuit switches on or off the coupling transistors according to read mode.

Image pickup apparatus having photoelectric conversion function

Image pickup apparatus

A semiconductor device with improved quality and reliability is provided. In a UBM formed over an electrode pad located over a semiconductor substrate, the edge (end) of an Au film as an upper layer is located inside or in the same position as the edge (end) of a TiW film as a lower layer, which can suppress the formation of a suspended part in the Au film. This arrangement can prevent the occurrence of electrical short circuit between the adjacent pads due to the suspended part and the adhesion of the suspended part as foreign matter to the semiconductor substrate, thus improving the quality and reliability of the semiconductor device (semiconductor chip).

Growing community of inventors

Tokyo, Japan

Zenzo Suzuki