Hitachi Powdered Metals Co., Ltd.

Honda Giken Kogyo Kabushiki Kaisha

Zenzo Ishijima

Hideo Shikata

Junichi Ichikawa

Narutoshi Murasugi

Hideo Urata

Kazunori Maekawa

Jun Sakai

Shuji Sasaki

Toshikazu Takehana

Shoji Kawase

Osamu Mawatari

Katsuhiko Ueda

Tamio Takada

Masahiro Okahara

Jun-ichi Ichikawa

Takahiro Jinushi

Jun-ichi Ueda

Syuji Sasaki

Yukihiro Nakayama

Takashi Matsumura

A forming die assembly for microcomponents includes a forming die and a punch. The forming die is formed with a cavity, a punch hole connected to the cavity, and a supply path for supplying a raw material with a metal powder and a binder having plasticity. The supply path is connected to the cavity so as to have a gate therebetween and is used for supplying the raw material into the cavity. The punch is slidably inserted into the punch hole, and it opens and closes the gate by reciprocatory sliding. The punch closes the gate and compresses the raw material in the cavity into a green compact by sliding in the direction of the cavity.

Forming die assembly for microcomponents

A production method for a thermoelectric conversion module having a thermoelectric conversion element and an electrode, which are metallurgically bonded together via a porous metal layer. The porous metal layer is made of nickel or silver and has a density ratio of 50 to 90%.

Thermoelectric conversion module and production method therefor

A forming die assembly for microcomponents includes a forming die, a plunger, and a punch. The forming die is formed with a cavity, a storage portion for storing a raw material with a metal powder and a binder having plasticity, and a punch hole that connects the cavity and the storage portion so as to form a gate therebetween. The plunger is formed so as to be slidably inserted into the storage portion and to fill the raw material stored in the storage portion into the cavity through the punch hole. The punch is slidably inserted into the plunger in the sliding direction of the plunger and opens and closes the gate by reciprocatory sliding. The punch closes the gate and compresses the raw material in the cavity into a green compact by sliding in the direction of the cavity.

A forming die assembly for microcomponents includes a forming die, a plunger, and a punch. The forming die is formed with an outer die, an inner die, a storage portion formed at the inner die, and a punch hole formed at the inner die. The inner die slidably inserted into the outer die forms a part of a cavity between the inner die and the outer die. The storage portion stores a raw material with a metal powder and a binder having plasticity. The punch hole connects the cavity and the storage portion and forms a gate therebetween. The plunger slidably inserted into the storage portion fills the raw material stored in the storage portion into the cavity through the punch hole. The punch is slidably inserted into the plunger, and it closes the gate and compresses the raw material in the cavity.

A production method includes: preparing a metal powder composed of one of Mo and W, and a binder composed of a thermoplastic resin and a wax; mixing the metal powder and 40 to 60 volume % of the binder with respect to the metal powder into a mixed powder; and heating and kneading the mixed powder into a raw material. The production method further includes: supplying a predetermined of the raw material in a hole of a die; and compacting the raw material into a cup-shaped green compact by pressing the raw material by a punch, the cup-shaped green compact having a cylindrical portion, a bottom formed at one end portion thereof, and an opening formed at another end portion thereof. The production method further includes: ejecting the cup-shaped green compact from the hole of the die; removing the binder from the ejected cup-shaped green compact by heating; and sintering the cup-shaped green compact by heating the green compact and diffusion-bonding particles of the green compact.

Production method of electrode for cold cathode fluorescent lamp

The invention proposes a copper-based material with low thermal expansion and high thermal conductivity having good machinability and adaptability to nickel plating and also proposes a method for producing the same. The copper-based material is prepared through the steps of: adding 5 to 60% of iron-based alloy power having a certain value in thermal expansion coefficient into a matrix powder of pure copper phase powder and/or a precipitation hardening copper alloy powder; mixing the powders together; compacting the obtained powder mixture into a green compact and sintering it at temperatures of 400 to 600&#xb0; C.

Method for producing copper-based material with low thermal expansion and high heat conductivity

This invention provides a germanium-containing health promoting appliance which is used by making it into contact with the skin, which is produced at low cost without requiring the after-machining. The health promoting appliance is made of a sintered material composed of 2 to 20% by mass of germanium and the remainder of stainless steel, the fine pores of which are desirably sealed up by a resinous material and it is produced by sintering a green compact of desired shape of powder mixture of the above composition, under the rate of temperature rise of 10&#xb0; C. per minute or less from 800&#xb0; C. to the retaining temperatures of sintering at 1000 to 1300&#xb0; C.

Health promoting appliance

Disclosed is a thin plate member for forming a semiconductor package, having a recess for receiving a semiconductor chip. The thin plate is composed of sintered metal, e.g. sintered copper or sintered alluminum alloy. A sintered metal body being porous and having a shape which is close to the shape of the thin plate member is prepared, and it is sized into the shape of the thin plate member. The sintered alluminum alloy comprises 0.4 to 0.8% by weight of magnesium, 0.2 to 0.6% by weight of silicon and the balance aluminum and has a structure comprising an aluminum phase being formed of aluminum particles and an alloy phase being composed of magnesium, silicon and aluminum and interposing between the aluminum particles, and the sintered copper has a metallographic structure comprising a phase of copper particles.

Thin plate member for semiconductor package and manufacturing method therefor

Sheet metal member, method of manufacturing same, and heat radiation

There is provided a connecting rod including a connecting rod body and a cap having excellent alignment properties, and a method of producing such a connecting rod. A connecting rod body and a cap are produced through the steps of molding green compacts respectively corresponding to the connecting rod body and the cap; sintering and unifying both the green compacts; forging the resultant sintered product in a mold; and fracturing the resultant forged product. The green compact corresponding to the cap and/or the green compact corresponding to the connecting rod body includes opposite circumferential end faces formed with one or more projection. A clearance c is formed between both circumferential end faces of the sintered product due to the projection. With this clearance c, both the circumferential end faces are formed with recesses and projections which are fitted to each other during the forging process and which are relatively large and thus have large biting amounts. During the fracturing process, the recesses and the projections are separated into two pieces.

Process for producing connecting rod

A plurality of blanks divided at a division end face 5 or a blank-bonded product comprising a plurality of blanks sintered and bonded together are or is compressed in the same mold, so that they are plastically deformed until the division end faces 5 are cohered. Thereafter, a load is applied to the plastically worked product in a direction of breaking of the division end faces 5 to break the division end faces 5 and divide the plastically worked product into a plurality of members. In this manner, a split type mechanical part having irregularities meshed with each other on mating faces and easily positionable relative to each other can be produced with a good dimentional accuracy.

Process for producing split type mechanical part

The Al-Si sintered alloy having good mechanical strength and elongation and is especially excellent in wear resistance, and a method for producing the same. The sintered alloy consists of 2.4-23.5% Si, 2-5% Cu, 0.2-1.5% Mg, 0.01-1% of transition metals and the balance of aluminum and unavoidable impurities, and has a dapple grain structure of an Al-solid solution phase and an Al-Si alloy phase containing dispersed pro-eutectic Si crystals having a maximum diameter of 5-60 .mu.m either in the whole body or in the surface contact portion, and the area ratio of the Al-solid solution phase in the grain structure is in the range of 20-80%.

Growing community of inventors

Matsudo, Japan

Zenzo Ishijima