Beijing Boe Technology Development Co., Ltd.

Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Zengqiang Zheng

Xue Dong

Xiaochuan Chen

Shengji Yang

Hui Wang

Pengcheng Lu

Kuanta Huang

Shengnan Li

Yixiu Liu

An integrated photo-sensing detection display substrate. The integrated photo-sensing detection display substrate includes a base substrate; a plurality of light emitting elements on the base substrate and configured to emit light, a portion of the light being totally reflected by a surface thereby forming totally reflected light; an addressable diffraction grating layer on a side of the base substrate away from the plurality of light emitting elements, and including a plurality of individually addressable diffraction regions, light diffraction respectively in the plurality of individually addressable diffraction regions being independently controllable; and a photosensor on a side of the addressable diffraction grating layer away from the base substrate and configured to detect light transmitted from one or more of the plurality of individually addressable diffraction regions, thereby detecting fingerprint information.

Integrated photo-sensing detection display apparatus and method of fabricating integrated photo-sensing detection display apparatus

An array substrate, a driving method, an organic light emitting display panel and a display device. The array substrate includes a plurality of light emitting devices and pixel circuits connected with the light emitting devices, both located in a display area as well as a plurality of voltage control circuits located in a non-display area, wherein at least two of the pixel circuits in one row share one of the voltage control circuits.

Array substrate with pixel circuits sharing voltage control circuit, driving method, organic light emitting display panel and display device

Embodiments of the invention disclose a chip removing device for facilitating the removal of a chip and reducing an influence on the flexible printed circuit board caused by heat, thereby optimizing the manufacturing process of the LCD panel. The chip removing device comprises: a handle; a heat supply unit mounted at one end of the handle, a detachable chip heating head provided on one side of the heat supply unit away from the handle; and a temperature controller in signal communication with the heat supply unit for controlling a temperature output by the heat supply unit.

Chip removing device

Growing community of inventors

Beijing, China

Zengqiang Zheng