Hewlett-packard Company

Zen Kurokawa

William R Knight

Ulrich E Hess

Eldurkar V Bhaskar

Peter M Burke

An inkjet printhead structure comprises novel resistor circuitry that is fabricated on two different substrate layers. The dual layer circuitry reduces the required substrate surface area and printhead shelf length to increase the printer operating frequency and print density. In one embodiment of the invention, heating resistors are spread out over portions of the substrate surface area and conductors are attached to opposite ends of the heater resistors in a novel configuration. To simplify routing, the circuitry is configured so that multiple heater resistors are coupled to the same conductor return path located on a second conductive layer. In a second embodiment of the invention, the heater resistors are dimensioned in the shape of a trapezoid to provide uniform heating. Alternative resistor shapes are then introduced to provide consistent heat dissipation for variances in resistor/conductor sheet resistance.

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Corvallis, OR, United States of America

Zen Kurokawa