Applied Materials South East Asia Pte. Ltd.

Actelis Networks (israel) Ltd.

Zeev Litichever

Erez Sali

Maya Bar-El

Oren Cohen

Inspection of objects such as semiconductor wafers may proceed on a cell-to-cell or die-to-die basis. An image of a wafer may be obtained and the cells or dies shown therein can be inspected using any combination of appropriate die-to-die or cell-to-cell inspection methods. For example, one or more areas may be designated for cell-to-cell inspection. For each cell type, a reference image can be generated by obtaining an image of the area and displacing the image by an amount equal to the repetition vector for that cell type in opposite directions. The displaced images and the original image can be combined into a single reference image. The original image can then be compared to the reference image. In some embodiments, the displaced images are also compared to the reference image to statistically determine the presence or absence of defects.

Advanced cell-to-cell inspection

In a communications system having a first modem transmitting via a communications channel, a method for adding a second modem, the method including learning crosstalk caused by transmissions from the first modem to the second modem while the second modem is in a transmitting state insufficient to cause crosstalk interference to the first modem in accordance with a predefined measure, deriving from the learned crosstalk an estimation of crosstalk that would be caused by the second modem to the first modem when the second modem is in a transmitting state, configuring the first modem to cancel crosstalk according to the crosstalk estimation, causing the second modem to enter a transmitting state sufficient to cause crosstalk interference to the first modem in accordance with a predefined measure, and causing the first modem to at least partially cancel crosstalk caused by the second modem in accordance with the crosstalk estimation.

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Rehovot, Israel

Zeev Litichever