Beijing University of Technology

International Business Machines Corporation

Boe Technology Group Co., Ltd.

Boe (hebei) Mobile Display Technology Co., Ltd.

Globalfoundries Inc.

Hewlett Packard Enterprise Development LP

Ze Zhang

Xiaodong Han

Wayne Harvey Woods, Jr

Xiaodong Wang

Hung H Tran

Douglas M Daley

Guowen Yang

Pan Liu

Jianfei Zhang

Zhipeng Li

Yonghai Yue

Yadi Zhai

Taonan Zhang

Jian Li

Yuefei Zhang

Mao Shengcheng

Dongfeng Ma

Xiaochen Li

Yue Wang

Wolfgang Sauter

Shuo Zhang

Yan Xa Zhou

Dian Guo Zou

Kun Zheng

Yun Chen

Yuan Hu

Baohong Zhu

Dongnian Han

Zhiyu Zhao

Qingsong Deng

Da Guang Sun

Changlin Mu

Liwei Xue

Shengcheng Mao

Chunqiang Zhuang

Xiao Hai Ma

Lantao Chen

Embodiments of the invention include a computer-implemented method for allocating computing resources. The computer-implemented method includes generating, using a processor, tracing data that results from data traffic processed through multiple data paths by the processor. The processor is used to analyze the tracing data to identify a predicted bottleneck path among the multiple data paths, wherein the predicted bottleneck path include a data path on which a data bottleneck is predicted to occur. The computer resources are allocated to the predicted bottleneck path before the predicted data bottleneck occurs.

Automatically controlling resource partitions in advance of predicted bottlenecks for log streaming messages

Transaction recovery in a cloud computing environment. Transaction recovery includes determining whether a first container of a plurality of containers in the cloud computing environment is crashed. In response to the first container being crashed, the method may include determining at least one transaction log entry from a first log file corresponding to the first container. Transaction recovery includes retrieving at least one in-doubt transaction corresponding to the first container from a first database corresponding to the first container. Transaction recovery includes comparing the at least one transaction log entry with the at least one in-doubt transaction for transaction recovery.

Transaction recovery

In an example, a logic apparatus of an interface board in a network device may generate an Ethernet flow control packet including sending completion information according to Ethernet data packets sent from a sending buffering queue maintained in the interface board. The logic apparatus of the interface board may transmit the Ethernet flow control packet including sending completion information to an Ethernet data channel by taking priority over Ethernet data packets in a receiving buffering queue in an ingress direction. The sending completion information is used by a CPU of a mainboard to maintain a state of the sending buffering queue.

Flow control of network device

A double-tilt in-situ nanoindentation platform for TEM (transmission electron microscope) belongs to the field of in-situ characterization of the mechanical property-microstructure relationship of materials at the nano- and atomic scale. The platform is consisted of adhesive area, support beams, bearing beams, sample loading stage and mini indenter. The overall structure of the platform is prepared by semiconductor microfabrication technology. The in-situ nanoindentation experiment can be driven by bimetallic strip, V-shaped electro-thermal beam, piezoelectric ceramics, electrostatic comb or shape memory alloys et. al. The sample is obtained by focused ion beam cutting. The integrated platform can be placed in the narrow space on the front end of the TEM sample holder, giving rise to the condition of double-axis tilt. The driving device drives the mini indenter to carry out in-situ nanoindentation, in-situ compression and in-situ bending and the like of the materials in TEM. The deformation process of material can be in-situ observed in sub angstrom, atomic and nano scale to study the deformation mechanism of material, which can further reveal the relationship of microstructure-mechanical properties of the material.

Double-tilt in-situ nanoindentation platform for transmission electron microscope

A double-tilt in-situ mechanical sample holder for TEM based on piezoelectric ceramic drive belongs to the field of material microstructure-mechanical properties in-situ characterization, and it comprise two parts of sample holder shaft body and piezoelectric ceramic drive system. The sample holder shaft body comprise tilt stage, sample holder, linear stepping motor, drive rod, drive linkage. The piezoelectric ceramic drive system comprise piezoelectric ceramic loading stage, piezoelectric ceramic, connecting base and the sample loading stage realizing stretch or compression function. The double-axis tilt of the samples in X and Y axis directions is realized by the reciprocating motion back and forth of the drive rod driven by the linear stepping motor. The stretch or compression of the samples is realized by applying voltage on the piezoelectric ceramic to generate displacement and push the sample loading stage by the connecting base. The invention coordinating with high resolution TEM realizes the observation of the microstructure in atomic and even sub angstrom scales, and at the same time it ensures the controllable deformation of nanomaterials, further realizes the integrative research on the material microstructure-mechanical properties and reveals the deformation mechanism of the materials.

Double-tilt in-situ mechanical sample holder for TEM based on piezoelectric ceramic drive

A double-tilt sample holder for TEM, comprising: it comprise the main body of sample holder body, front-end tilt stage, drive rod, linkage, tilt axis, rotation axis, fixed axis of drive rod and sample loading stage. The axis hole is arranged at the front-end tilt stage, which is connected to the main body of the sample holder body by the tilt axis. The linkage, the boss slot and the drive rod slot are connected by the rotation axis. Two through movement guide grooves are designed symmetrically at both sides of the front-end of sample holder body, and the drive rod is fixed by the fixed axis of the drive rod, which restricts the drive rod to move reciprocally in a straight line driven by the linear stepping motor at the back-end of the main body of the holder body, further leading the tilt stage to rotate around the tilt axis. The tilt angle of the sample loading stage can be precisely controlled by the high precision linear stepping motor in the apparatus. The maximum tilt angle of the sample stage can be adjusted by the included angle between the boss at the bottom surface of the front-end tilt stage and the horizontal direction and the length of the movement guide groove in the apparatus. The apparatus can be used coordinately with TEM and its universality is wide.

Double-tilt sample holder for transmission electron microscope

A display module detection device is disclosed. The display module detection device includes a storage module, in which configuration parameters of multiple types of display modules are pre-stored for determining a configuration parameter to be outputted by the storage module based on a type of a display module to be detected, and a test system module being communicatively connected with the storage module and configured for determining an output parameter of a test signal output interface based on the configuration parameter outputted by the storage module.

Display module detection device

A flexible circuit board and a cutting device are provided. The flexible circuit board includes a board body including a cutting region. A plurality rows of testing terminals are located in the cutting region, a first spacing being provided between two adjacent rows of testing terminals. The testing terminals can be respectively cut off from the board body along a cutting direction which is along the extending direction of the first spacing in the board body. A testing circuit is located on a surface of the board body. The testing circuit is arranged in a region outside the cutting region and the testing circuit is independently and electrically connected to each row of the testing terminals.

Flexible circuit board and cutting device

The present invention discloses a touch panel scribing detection device and a detection method thereof. The touch panel scribing detection device includes a loading platform, a scribing standardization unit, a test unit and a signal unit. The touch panel scribing detection device can provide an accurate scribing test path, so the accuracy and efficiency of manual test on a touch panel can be improved.

Touch panel scribing detection device and touch panel scribing detection method

A first pair of resistors formed in a first layer of material, and a second pair of resistors formed in the first layer or in a second layer can be wired into a Wheatstone bridge to form a temperature sensor. Either layer can include a semiconductor or a dielectric. In a semiconductor layer, a pair of resistors can be doped areas of the layer, while in a dielectric, a pair of resistors can be material deposited in cavities in the layer, such as material from an added 'middle-of-line' (MOL) metallization layer.

Thermoresistance sensor structure for integrated circuits and method of making

Device structures, fabrication methods, and design structures for tunnel field-effect transistors. A drain comprised of a first semiconductor material having a first band gap and a source comprised of a second semiconductor material having a second band gap are formed. A tunnel barrier is formed between the source and the drain. The second semiconductor material exhibits a broken-gap energy band alignment with the first semiconductor material. The tunnel barrier is comprised of a third semiconductor material with a third band gap larger than the first band gap and larger than the second band gap. The third band gap is configured to bend under an external bias to assist in aligning a first energy band of the first semiconductor material with a second energy band of the second semiconductor material.

Tunnel field-effect transistors with a gate-swing broken-gap heterostructure

Stacked chip systems and design structures for stacked chip systems, as well as methods and computer program products for placing thermal conduction paths in a stacked chip system. The method may include determining an availability of space in a layout of an interconnect structure of a first chip for a fill shape structure extending partially through the interconnect structure to thermally couple a metal feature in the interconnect structure with a bonding layer between the interconnect structure of the first chip and a second chip. If space is available, the fill shape structure may be placed in the layout of the interconnect structure of the first chip. The stacked chip system may include the first and second chips, the bonding layer between the interconnect structure of the first chip and the second chip, and the fill shape structure.

Thermally-optimized metal fill for stacked chip systems

A double tilt sample holder for in-situ measuring mechanical and electrical properties of microstructures in transmission electron microscope (TEM) is provided. The sample holder includes a home-made hollow sample holder body, a sensor for measuring mechanical/electrical properties, a pressing piece, a sample holder head, a sensor carrier. The sensor for measuring mechanical/electrical properties is fixed on the sensor carrier on the sample holder head by the pressing piece, while the sensor carrier is connected to the sample holder head through a pair of supporting shafts located on sides of the sample holder head. The sensor carrier can tilt within the plane perpendicular to the ample holder head by revolving around the supporting shafts (i.e. tilting along Y axis at an angle of &#xb1;30&#xb0;). The sample holder also allows obtaining mechanical/electrical parameters concurrently.

Double tilt transmission electron microscope sample holder for in-situ measurement of microstructures

A sensor for quantitative testing electromechanical properties and microstructure of nano-materials and a manufacturing method for the sensor are provided. The sensor comprises a suspended structure, pressure-sensitive resistor cantilevers, support beams, bimetallic strip and other components. When the bimetallic strip produces bending deformation, one of the pressure-sensitive resistor cantilevers is actuated and then stretches the low-dimensional nano-materials which drive the other pressure-sensitive resistor cantilever to bend. Through signal changes are outputted by the Wheatstone bridge, the variable stresses of low-dimensional nano-materials are obtained. Meanwhile, the variable strains of low-dimensional nano-materials are obtained by the horizontal displacements between two cantilevers, so the stress-strain curves of low-dimensional nano-materials are worked out. When the low-dimensional nano-materials are measured in the power state, the voltage-current curves are also obtained. In addition, by the help of high resolution imaging system in the transmission electron microscopy, the mechanical-electrical-microstructure relationship of the nano-materials can be recorded in situ and in atomic lattice resolution.

Sensor for quantitative measurement of electromechanical properties and microstructure of nano-materials and method for making the same

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Beijing, China

Ze Zhang