Motorola Corporation

Zalman Schwartzman

Gadi Shirazi

Anbuselvan Kuppusamy

Hal R Canter

James L Stephens

Aharon Kashtan

Gil Rapoport

Justin R Wodrich

Izidor Gershkovich

Michael S Beard

Eytan Ramon

Kathleen Farrell, Legal Representative

An apparatus () is provided for dispersing heat from an integrated circuit () to a heat sink (). The apparatus () is formed on a nonconductive body () having at least two conductive surfaces () disposed thereon. One of the conductive surfaces () is reflowed to a heat generating lead of the integrated circuit (), and the other conductive surface () provides a surface for contacting a heat sink (). The apparatus () and integrated circuit provide a package () which can be tape and reeled () for easy mounting to a printed circuit board () of a communication device ().

Method and apparatus for dissipating heat from an integrated circuit

FIGS. 2 and 3 illustrate communications devices (30) that are operable in both a radio dispatch mode and a telephone interconnect mode. To mitigate the problem of a relatively high level audio signal from being unexpected broadcast from an ear-piece of the device (30) when the ear-piece is proximally located with an ear of a user of the device, the communications device (30) is arranged to ensure that, at least during an initial period of operation in either of the two operating modes, audio signals of relatively high level do not originate from the ear-piece, thereby preventing a change in audio power output from the ear-piece that may potentially cause damage to the hearing of a user of the radio communications device.

Volume control for a dual mode communications device

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Rehovot, Israel

Zalman Schwartzman