Infineon Technologies Ag

Zakaria Abdullah

Ralf Otremba

Abdul Rahman Mohamed

Chee Soon Law

Fong Lim

Subaramaniym Senivasan

An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a shank having a holder and an intermediate body connected to the holder by a first joint. The pick-up head further includes a collet head connected to the intermediate body by a second joint.

Adjustable pick-up head and method for manufacturing a device

A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a ribbon. The ribbon includes a first metal layer and a second metal layer. The first metal layer is welded to the first chip and the second metal layer is attached to the second chip.

Growing community of inventors

Seremban, Malaysia

Zakaria Abdullah